COMPONENT DESIGN
Unlocking innovation in electronic component design with photo-chemical etching
Jochen Kern, sales and marketing director, micrometal Group I
n today’s fast-paced electronics industry, the pressure to innovate has never been greater. Designers are constantly challenged to create smaller, more precise and more complex components, all while maintaining exceptional performance and reliability. Achieving these goals often requires a rethinking of traditional manufacturing methods and this is where photo-chemical etching (PCE) offers a compelling advantage.
Driving innovation through precision PCE is not just a manufacturing technique, it is a gateway to design freedom. Unlike traditional subtractive processes such as stamping or laser cutting, PCE uses a controlled chemical reaction to create intricate, burr-free metal components. What sets it apart is its ability to achieve without introducing mechanical stress or heat distortion, both of which are critical in the development of advanced electronic components.
For instance, consider the growing demand for precision in thin metal components for sensors. As industries like automotive and industrial IoT adopt increasingly compact designs, the need for reliable, miniaturised sensors has skyrocketed. PCE enables the production of sensor diaphragms, strain gauges and electrical contacts with unparalleled precision and repeatability. This level of accuracy enhances sensor sensitivity and ensures reliability in even the most demanding applications.
Enabling design freedom without tooling constraints
electronic component designers is its tooling process or, rather, the lack thereof. Unlike stamping, which requires expensive, rigid tooling, PCE uses photolithographic masks to are inexpensive to produce and can be and fast design iteration.
complex designs that might otherwise be
cost-prohibitive. For example, manufacturers of lead frames for semiconductor devices patterns and precise alignment features at scale. The absence of tooling constraints also means that designers can move seamlessly from prototype to high-volume production without needing to invest in costly retooling.
Precision for high -performance applications
In the realm of high-performance electronics, even minor imperfections in component geometry can lead to signal loss, interference or failure under stress. PCE addresses these parts with exceptional surface quality. By way of example, RF shielding components often require precision slots and perforations to ensure effective electromagnetic compatibility (EMC). Traditional methods like stamping can introduce inconsistencies or distortions that compromise performance. With PCE, these shielding components can ensuring optimal signal integrity while maintaining structural integrity. Similarly, battery connectors for portable electronics, such as smartphones and wearables, demand both precision and durability. PCE enables the production of thin, lightweight connectors with smooth edges
and uniform thickness, contributing to better electrical conductivity and improved product performance.
Promoting sustainability in electronic design
In addition to enabling cutting-edge innovation, PCE aligns with the industry’s increasing focus on sustainability. The process minimal waste compared to subtractive methods like machining. This is particularly relevant in the electronics sector, where reducing resource consumption is a key priority. The use of chemical etching also ensures that materials retain their inherent properties, such as hardness and conductivity, without the need for post-processing. This not only reduces energy consumption, but also time-to-market for new designs.
Opening doors to the future As electronic component design evolves, the need for manufacturing processes that support complexity, precision and sustainability will only grow. PCE has already proved itself as a vital tool for enabling circuits to micro-scale connectors and beyond.
14 FEBRUARY 2025 | ELECTRONICS FOR ENGINEERS
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