Sensors & transducers
NANUSENS SECURES FIRST IP LICENSE FOR ITS REVOLUTIONARY MEMS-IN-ASICS SENSOR TECHNOLOGY
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DRAW-WIRE SENSORS NOW OFFER LARGER MEASURING RANGES AND CANOPEN INTERFACE
need to be compact, provide large measuring ranges (typically 6 m to 8 m) and offer an attractive price/performance ratio. A common application for draw-wire sensors in mobile machinery is the measurement of boom and support positions. Telescopic loaders, for example, often require a measuring range of 8 m. In addition to analogue outputs, the demand for digital interfaces is also increasing, particularly for CANopen. To better serve these applications, Micro- Epsilon has expanded its wireSENSOR WPS-MK88 and wireSENSOR WPS-K100 series of draw-wire sensors with larger measuring ranges and CANopen interface. The wireSENSOR K100 series of draw-wire displacement sensors measure distance and position precisely, combining high performance for outdoor use with an excellent
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price/performance ratio. The series now offers a larger measuring range of up to 8 m, as well as a CANopen interface for all measuring ranges up to 8 m, making the sensors ideal for off- highway vehicles, mobile machinery, mobile cranes and lifting technology. The compact K100 series is protected by a glass fibre-reinforced plastic housing, as well as separate drum and spring spaces, making the sensors extremely
raw-wire displacement sensors from Micro-Epsilon are used successfully in many different industries, one of the most important being mobile machinery, where the sensors
robust (IP69K) against external influences. The MK88 series of draw-wire sensors has also been expanded with a larger measuring range of up to 6 m, as well as a CANopen interface for all measuring ranges up to 6 m. The MK88 is specially designed for mobile applications in series such as mobile cranes and mobile working platforms. The combination of compact size, robustness and price makes the sensors unique, offering new potential in design and cost optimisation.
EVER-EXPANDING PORTFOLIO Draw-wire displacement sensors from Micro- Epsilon are extremely robust and flexible. They measure positions and distances between 50 mm and 50 m. Robust housings protect against external influences. Due to their compact design, the sensors can also be integrated in narrow installation spaces. Measurements are performed in a simple way, quickly and with a long sensor service life. Output of measurement values is either analogue or digital, depending on the sensor model. For customer applications, various adaptations can also be implemented at any time. For example, the measuring wire can be guided over deflection pulleys to achieve an ideal measuring situation. Micro-Epsilon’s portfolio of draw-wire displacement sensors includes more than 120 models in different designs and measuring ranges.
Micro-Epsilon
www.micro-epsilon.co.uk Dr Josep Montanyà, CEO of Nanusens,
says, “Azoteq is one of a number of companies that recently received samples of our 3D accelerometer that were created using an IP block within an ASIC. Azoteq is the first to sign an IP license and we plan to announce several more license deals soon.” Dr Dieter Mellet, Azoteq’s CTO, comments,
“Our business is based on creating multi- sensor solutions for customers who often need to include many sensors into space- constrained applications. Nanusens technology enables monolithic integration of MEMS within an IC and is perfect for us as we can now embed an array of 3D accelerometers into an existing IC, providing cost, power and space saving to our customers over current solutions available today further expanding our ProxFusion offering.”
Nanusens
nanusens.com August 2023 Instrumentation Monthly
anusens, a fabless semiconductor company supplying novel MEMS sensors built inside CMOS, has announced the first IP license agreement for its
MEMS-in-ASICs technology with Azoteq, a pioneer in high volume sensor fusion ICs used in industrial and consumer applications. Nanusens technology enables its MEMS (Micro Electro Mechanical Systems) IP sensor structures to be made at the same time within a chip as other IP on the ASIC using standard CMOS processes, resulting in ASICs with embedded MEMS sensors. This breakthrough of the integration of sensor solutions as IP blocks offers dramatic reductions in costs and size as it completely replaces the current solution of discrete sensor packages.
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