Evactron Series Decontaminators and Cleaning Systems


®


Overview Volatile hydrocarbon molecules are an unavoidable constituent of all vacuum chambers. They are introduced into the chamber through atmospheric (adventitious) contamination, lubrication, or inadvertent contamination by users. This contamination does not pose an issue in and of itself.


However, if energetic radiation such as the electron beam of a scanning electron microscope, an ion beam from a FIB, or EUV radiation of the next generation of lithography tools is used, then the hydrocarbon contamination will cause problems. As the hydrocarbons adsorb onto a surface impinged by the energetic radiation, e.g. a sample examined in an SEM or a mirror in an EUV lithography tool, they will be chemically altered by the radiation and then recombine into less volatile polymers. More adsorbed hydrocarbons will diffuse into the impingement area, and a buildup of polymeric carbon will occur.


Evactron® Model EP


Plasma Decontaminators The Evactron®


E-Series™ of remote RF plasma


cleaners reduces hydrocarbon contamination from high vacuum chambers by breaking down the carbon and turning it into gas phase that are then removed by the pumping system.


Features • High cleaning efficiency


• Small footprint/compact plasma radical source (PRS)


• Operates at TMP and turbomolecular pressures • “Pop” ignition (patent pending) • Windows and Android GUI software • Desktop controller • Fits chambers and load locks • Vacuum safety interlock


The Evactron® EP Decontaminator is the latest model


in the E-Series cleaning systems. It was designed for: • Cleaning high vacuum chambers, SEM/FIB • Pre-cleaning of the samples


The Evactron® EP model with instant ignition from


any vacuum level brings the user highest cleaning rates at low pressures. It uses flowing afterglow to remove surface hydrocarbons from vacuum chambers operating with turbo molecular pumps.


Black square caused by hydrocarbon contamination seen in SEM image.


Carbon buildup leading to loss in reflectivity seen on an EUV mirror.


In microscopes this buildup will reduce the image quality. When the user reduces the magnification, a black square due to the carbon buildup will be seen on the SEM image. In EUV lithography, the mirror will also suffer a carbon buildup which will cause a reduction in the reflectivity of the mirror. Less reflectivity will cause a much reduced throughput of the lithography tool.


Description


Technology Energy efficient hollow cathode plasma Flow through gas supply Plasma Radical Source (PRS) design maximizes delivery of radicals to chamber “Pop” ignition of the plasma works at pressures below 100 Pa/750 mTorr Low pressure operation 1-3 Pa/7.5-22.5 mTorr Starts and operates at turbo molecular pump compatible pressures Fixed match provides maximum plasma power transfer


Other Features High reliability at 20 Watts and 13.56 MHz power supply No vacuum gauge needed NW 40 flange standard, CF 2.75 optional Vacuum only operation interlock >100 Å/min cleaning rates Rack mount for system integration Elegant and compact design Windows GUI interface/Android tablet programming compatibility


Ordering Information Attachment Flange required, sold separately. See below. Cat. No.


For Hitachi 8200 /4800 Series SEM 91000-11 Evactron®


For JEOL TMP Systems 91000-12 Evactron®


For Zeiss 91000-13 Evactron®


EP De-Contaminator System, + Android


Consisting of: Evactron EP Plasma Radical Source, Horizontal Configuration, Windows 7.0 GUI Programming Software, Evactron EP Table Top Controller, Evactron EP Cable Set (12.5ft), System user manual


EP De-Contaminator System, + Android,


Consisting of: Evactron EP Plasma Radical Source, Horizontal Configuration, 1 cc ignition ballast, Windows 7.0 GUI Programming Software, Evactron EP Table Top Controller, Evactron EP Cable Set (12.5ft), System user manual


EP De-Contaminator System, + Android


Consisting of: Evactron EP Vertical Plasma Radical Source, Evactron EP Table Top Controller, Evactron EP Cable Set (12.5ft), Evactron EP GUI Programming Software, System user manual


Evactron®


Removed contamination by Evactron cleaning results in no black square.


Carbon buildup removed from same EUV mirror shown above.


Cat No. Adapter Flanges – SEM Port to KF40


All dimensions are in millimeters OD = Outside Flange diameter ORID = O-Ring Inside Diameter


Description


230090-01 FEI, 64 X 80, 50 ORID, 4H, OCTG, ASYM 230141-01 FEI, 100 OD, 75 ORID, 6H


230142-01 FEI, 100 OD, 72 ORID, 88 BC, 3H 230143-01 FEI, 90 OD, 60 ORID, 78BC, 3H 230153-01 FEI, 85 OD, 60 ORID, 76 BC, 3H 230154-01 FEI, 100 OD, 70 ORID 84.5 BC, 3H 230155-01 FEI, 64 OD, 38 ORID, 57 BC, 4H


Qty.


each each


each each each each each


230235-01 FEI, 70 OD, 33 ORID, 61 BC, 4H, PLUG, 1 PIECE each 230335-01 FEI, 87 OD, 60 ORID, 74 BC, 3H 230350-01 FEI, 120 OD, 93 ORID, 109 BC, 6H 230351-00 FEI, 59 OD, 38 ORID, 52 BC, 4H, 1 PIECE


each each each


#H = number of mounting holes + symmetry O-ring not included with Adapter Flange The most common Adapter Flanges are shown


Cat No. Description


230359-01 FEI, 90 OD, 70 ORID, 80 BC, 3H 230006-01 HITACHI, 57 OD, 34.5 ORID, 50 BC, 4H


230320-01 HITACHI, 58 X 58, 24 ORID, 41.5 BC, 4H, PLUG, 1 PIECE


230568-01 HITACHI, 69 OD, 47.5 ORID, 4H 230001-01 JEOL, 64 OD, 40 ORID, 55 BC, 4H


230002-01 JEOL, 99 OD , 75 ORID, 89 BC, 4H, 38 (1.5") LONG NIPPLE


230002-02 JEOL, 99 OD, 75 ORID, 89 BC, 4H, 64 (2.5") LONG NIPPLE


Qty.


each each


each each each


each each each each


Qty. each


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