IN-MOULD DECORATION | PROCESSING
In-mould decoration innovations include thin-wall lids made in less than 4 seconds, inks that raise aesthetic performance and advances in touch sensors and displays
Embedded benefits: in-mould decoration
In-mould decoration (IMD) is typically used to produce packaging labels. Because they are incorporated into the packaging, they usually have no need for adhesives – meaning they are usually straightforward to recycle. German thin-film specialist Leonhard Kurz has showcased several new decoration technologies at recent exhibitions. At Embedded World earlier this year, Kurz and its subsidiary PolyIC showed innovations in touch sensors, display integration and functional decora- tion – for applications such as automotive interiors and home appliances.
One was the Hidden Display, developed with display integration specialist for high Data Modul. When deactivated, the surface appears as an elegant decor – such as in wood or stone optics – and only reveals a full LCD display after activation. This is made possible by thin-film technology from Kurz, which is used to manufacture the hidden display. “The combination of highly developed sen- sor technology and appealing design opens up
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new application possibilities for operating and display concepts,” said Wolfgang Clemens, director of product management and business develop- ment at PolyIC. Kurz has also combined IMD with a new coating technology that reduces reflections. The finishing technique is suitable for a range of plastic materials and is suitable for functional and design innova- tions, says the company. New display stacks, developed with Elektrobit, are a possible alterna- tive to conventional glass. Plastic replaces the front screen and is combined with IMD-decorated surfaces and integrated touch sensors. The technology combines the design flexibility
of plastic with the performance of capacitive touch systems. The front of the injection-moulded polycarbonate display panels is finished using IMD, while the back has conductive metal mesh sensors. Another collaboration, with AMS Osram, has led to a new way to integrate mini-LEDs into 3D surfaces has been developed. The interaction of IMD and functional foil bonding (FFB) enables the imple-
May/June 2025 | INJECTION WORLD 13
Main image: Kurz displayed a number of new technolo- gies at
Embedded World earlier this year
IMAGE: KURZ
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