MATERIALS | HIGH TEMPERATURE PLASTICS
provide excellent glycol resistance. As automotive electronics become more
complex and compact, surface mount technology (SMT) and reflow soldering is growing in use, demanding connector insulation materials that can withstand higher temperatures than in the past. Another important requirement is the prevention of corrosion of the metal contacts in the electronics assemblies. To address these issues, several connector material suppliers have in recent years developed high-heat grades that prevent electric corrosion by using organic heat stabilisation additive packages. DuPont is one of them, with its Zytel HTN Electri-
DMA analysis shows that Solvay’s Amodel Supreme A-9004 has a much higher Tg than a PA6T/6I, before and after conditioning. Water absorption is 20% less
Source: Solvay
cally Friendly (EF) portfolio, which continues to grow. Latest addition is Zytel HTN42G30EF, a 30% glass fibre-reinforced, PPA grade with 22% renewable content (the company does not divulge the exact nature of the polymer). “In addition to the signature electrochemical corrosion resistance and high temperature resistance of all DuPont’s EF grades, this product features high flow and improved reflow performance,” the company says. “Together, they enable thin-wall, miniaturised designs such as multi-pin, fine pitch and low height connectors, and contribute to accelerated cycle times.” DuPont also points to the ability of Zytel HTN42G30EF to withstand reflow soldering temperatures with minimal discoloration. “This can help automotive tier suppliers achieve greater outputs of high-quality PCB and FAKRA connectors,” it says.
Other key properties of the materials include high Comparison of flow and elongation at break of various PPAs Source: DuPont
impact resistance, which helps minimise breakage during assembly, and high weld line strength. The comparative tracking index (CTI) for both natural colour and black (laser markable) versions is 600V. Also aiming at electronics applications is
Kurarary. Several months ago, it expanded its Genestar E&E grade portfolio with halogen-free, UL94 V-0 30% glass fibre reinforced compounds based on PA9T. Kuraray says the grades combine a good processability with JDEC MSL 1 blister resistance. In addition, they have high weld-line strength and a CTI of Performance Level Catego- ries PLC class 0 (ASTM D3638) and Material Group I, of over 600V (IEC 60112).
Additions include Genestar GP2300S, which has
V-0 properties for the thickness range from 0.15 up to 3.0 mm, and which Kuraray says “is the ideal solution for different types of surface mount reflow connectors that require V-0 flammability.” Laurent Hulpiau, Genestar sales engineer at
Comparison of maximum reflow soldering temperature that various PPAs can withstand without blistering
64 COMPOUNDING WORLD | October 2020 Source: DuPont
Kuraray subsidiary Eval Europe, says recent studies using an adapted test set-up at Kuraray’s R&D
www.compoundingworld.com
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