LIGHTWEIGHTING
Multi-layer Flexi-hibrid circuit assembly, sealed
and bonded to inner form of moulded shield
printed circuit board assemblies to be over-moulded through injection moulding techniques delivering electronic functionality without the need for a separate protective box. The limiting factor with this approach is that the stresses imposed by injection moulding can significantly limit the type and number of electronic components integrated in this way and mostly requires some level of smaller external box containing the main electronic control functions. This solution also renders the moulded unit non-recyclable as the very nature of the injection moulding process means that it is virtually impossible to recover the individual materials at end-of-life. For over 25 years, In2tec has been
pushing the boundaries in the design and delivery of flexible electronics, dedicating its resources to breaking down barriers in design to solve the most complex problems with pioneering technology solutions. In the case of electronic integration with plastic or composites, the company has taken a more elementary
approach. Rather than moulding ‘in’ the electronics, In2tec utilises its Flexi-hibrid Electronic circuit board technologies and developed OMSE (On Mould Sustainable Electronics). “In simple terms, we take a circuit board manufactured on flexible or semi-rigid substrates and laminate it ‘onto’ sympathetically designed superstructures,” says Neil Armstrong, group managing director. Mark Hudman, chief technology officer at In2tec, adds, “This provides a far simpler single unit that can be moulded with traditional methods and integrates high complexity electronic circuits in an environmentally protected single element”. Utilisation of real estate is the key
value here. Integrating electronics onto superstructures within the vehicle significantly reduces the need for protective enclosures and in design can minimise the connector count. In addition, the ability to use areas of the vehicle not normally associated with electronics allows weight to be re-distributed and the centre of gravities lowered. For
OMSE integrating electronic systems through highly recyclable Flexi-hibrid Technologies
example, taking the seat control ECU (traditionally a plastic box with mechanical fixings housing the control and power electronics packaged primarily in the base of the seat system) and essentially dispersing the electronics onto a flexible substrate and laminating it to the internal seat back moulding reduces weight, and dramatically improves packaging constraints. It changes the whole paradigm of electronic integration and systemically engages both mechanical and electronic, or mechatronic design methodology providing a real synergy. If we think about pushing the
boundaries through innovation, Flexi- hibrid technologies can deliver planar interconnect systems (essentially flat wiring harness applications) with the electronic controls embedded in the wiring systems. Significantly reducing the number of connectors and the re-distribution of harness weight would revolutionise the advancement of traditional wiring harness design. Today, In2tec has already made possible printed flat shielded twisted pair designs through its patented technology, and low current transmission of power and data is delivered and demonstrated. A flat thermoformed wiring assembly with the CAN nodes integrated into the assembly provides a ‘stick and play’ approach to assembling the harness. “Full wiring systems delivering comms and power on flat formed surfaces is our end goal” states Hudman. “Just think if we can produce a wiring harness in the shape of a vehicle floor pan, adhere it simply onto the floor utilising all that real estate and doing so lowering the harness weight by over 40%. These are the predictions we have modelled.” Electronics now has solutions
to fully support and change the paradigms of electronics integration within the boundaries of automotive lightweighting, allowing designers to balance the additional functionality with minimising the weight increase. Maybe the lightweighting nirvana is closer than we think.
Neil Armstrong is managing director at In2tec:
www.in2tec.com
www.engineerlive.com 29
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52
