COVER STORY
How 3D printed quantum sensors are pioneering the future of heterogeneous integration
Heterogeneous integration enables the development of free-form 3D electro-mechanical designs I
n the burgeoning fi eld of quantum sensing, technological advancements are pushing the boundaries of what is possible. A
prime example is the development of sensors based on nitrogen-vacancy (NV) centres in diamond, which have the extraordinary capability to measure the minuscule magnetic fi elds generated by neural currents in muscles and the brain. Despite their potential, the current limitations in size and cost are signifi cant barriers to widespread adoption. Heterogeneous integration using
3D printed electronics presents a transformative solution, promising to revolutionise the scale, cost, and scalability of these quantum sensors, with applications ranging from controlling prosthetics to aiding locked-in patients.
THE PROMISE OF 3D PRINTED ELECTRONICS 3D printing has revolutionised various industries by enabling rapid prototyping and cost- eff ective manufacturing of complex
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components. In the realm of quantum sensors, 3D printed electronics can integrate multiple materials and functionalities into a single device. This capability is crucial for the development of compact and aff ordable quantum sensors.
HETEROGENEOUS INTEGRATION Heterogeneous integration in the context of electronics development refers to the assembly of diff erent types of materials and electronic components into a single system. For quantum sensors, this means combining the diamond substrate housing NV centres with other essential electronic components like readout circuits, signal processors, and wireless communication modules. 3D printing technology enables this integration by precisely depositing particles of diff erent conductive and dielectric materials, layer-by-layer to form complex structures that traditional manufacturing methods cannot achieve. With the rapid advancement of
sophisticated 3D printing technologies, heterogeneous integration now enables the development of free- form 3D electro-mechanical designs and intricate 3D line and spacing confi gurations. This technology also supports the implementation of true twisted pair transmission line routing and tridimensional routing, eff ectively minimising loss generators. Moreover, the miniaturisation and
condensation of devices are particularly invaluable for the creation of next- generation electronic systems. These capabilities allow for unprecedented fl exibility in designing and manufacturing quantum sensors, paving the way for innovative applications and improved performance.
DRAGONFLY IV The DragonFly IV by Nano Dimension exemplifi es the cutting-edge in 3D printed electronics, specifi cally tailored for creating sophisticated PCBs and electronic components. Additively Manufactured Electronics (AME) using the DragonFly IV eliminates many challenges associated
QUANTUM SENSORS
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