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Lasers ♦ news digest


between people and information, and a competence centre for ultrawideband (UWB) chipset and module development.


“We successfully used the ADS front-to-back design flow for UWB power amplifier MMIC design in a WIN pHEMT process,” says Shogo Ida, president and chief executive officer at GIT. “We also used it when expanding our portfolio to include silicon-based designs using IBM’s high-performance SiGe BiCMOS technology. We chose ADS because it delivers proven RF circuit simulation, integrated EM solvers and RF-relevant backend support. It was key to our first-time-right tape-outs and enabled us to introduce unique products on time.”


Agilent says ADS is the most widely used platform for III-V MMIC design but also provides a complete RFIC design flow - including layout, enhanced foundry-certified PDKs, LVS and DRC - that is crucial for a successful implementation of wireless front-ends.


The scalable front-to-back solution not only facilitates the job of the MMIC and RFIC designer from the beginning, but also directly integrates with other domains, such as RF modules and RF system-in-package (SiP) design.


Key ADS features like ADS Layout and Desktop DRC and LVS help simplify and speed the design flow. ADS Layout, for example, features an RFIC toolbar for easier, more efficient physical design and trace routing. Desktop DRC and LVS help verify and correct layouts against foundry DRC rules prior to tape out and catch errors early in the design cycle, all from the users’ desktop. In addition, ADS’ integrated 3D planar EM simulator Momentum combines full-wave and quasi-static EM solvers for simplified passive, interconnect and parasitic modelling.


“As a leader in the GaAs MMIC world, we have seen the popularity of the ADS platform for silicon-based RFIC design grow tremendously over the years,” says Juergen Hartung, RFIC marketing manager for Agilent EEsof EDA. “Customers can now use these kits for a variety of RF CMOS, RF SOI and SiGe BiCMOS technologies to enjoy full back-end support that includes schematic-driven layout creation, layout-versus- schematic check, and integrated 3D planar electromagnetic and 3D-FEM simulators.”


Skyworks CEO David J. Aldrich elected Board chairman


With Liam K. Griffin promoted to president, the new organisational structure has been designed to enhance the next phase of Skyworks’ long term strategic development


Skyworks Solutions, Inc. has announced that its board of directors has elected David J. Aldrich chairman of the board and CEO of Skyworks.


David J. McLachlan, prior chairman, will remain a member of Skyworks’ board of directors and has been designated as lead


A conceptual vision for an integrated 3D camera with multiple pixels using the FMCW laser source (Credit: Behnam


June 2014 www.compoundsemiconductor.net 87 independent director.


McLachlan has been a director at Skyworks since 2000 and has been chairman since 2008. “It has been a privilege to serve as chairman of the board of Skyworks,” says McLachlan.


“This is an exciting time for the company as it enters into the next phase of growth - capitalising on the tremendous opportunity within the Internet of Things. Dave Aldrich has been instrumental in Skyworks’ advancement into a leading analogue company within the semiconductor industry. I look forward to continuing to work with him as lead independent director.”


In addition, Liam K. Griffin has been promoted to the role of president. He had previously served as executive vice president and general manager. “This structure will enable us to hone our focus on long term strategic growth opportunities during this transformative time for Skyworks,” says Aldrich.


“Liam has a proven track record of results and I am confident that in his new role, he will continue to provide strong leadership and direction as we accelerate our evolution into a larger and more diversified analogue semiconductor company.”


Lasers VCSELs and MEMS unite to


enhance 3-D imaging A new low power compact laser combining III-Vs and silicon could provide exceptional range for potential use in self-driving cars, smartphones and interactive video games


A new twist on 3-D imaging technology could one day enable your self-driving car to spot a child in the street half a block away, let you answer your smartphone from across the room with a wave of your hand, or play “virtual tennis” on your driveway.


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