Volume 35 Issue 04 2013
features COVER STORY
26 Die and flip-chip bonding striving for ultra high precision Cost-effective surface mounting of complex stacked die using TSV interconnect calls for ultra-high-precision die and flip-chip bonders. Consequently, back-end equipment vendors and process designers must come up with modular concepts to accommodate a broad scope of micro-assembly tasks.
30 Meeting advanced packaging geometries
through material advancements The boom in the mobile market with increasing demands for smaller geometries has created the need for novel and innovative chemistries to overcome the limitations of existing materials.
34 Europe’s semiconductor industry can become a global force again
The European Commission’s decision to spend up to 10 billion euros for R&D activities will create new opportunity for Europe globally.
36 MUF and wafers get new acoustic tools Modifications of production processes and changes in device dimensions
require new non-destructive techniques to inspect for reliability.
42 Testing modern power semiconductor devices requires modern curve tracers
The traditional curve tracer has significant limitations when it comes to testing modern power semiconductor devices. Fortunately, the Source Measure Unit (SMU) offers a capable test solution.
30 Volume 35 Issue 4 2013
Material advancements
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www.siliconsemiconductor.net
Cost-effective surface mounting of complex stacked die
New acoustic tools for wafers
Die and fl ip-chip bonding strive for ultra high precision
Europe’s new global force
industry research 14 Taking nanoscale lithography into the third dimension 16 Revolutionising electronics with nanotechnology 18 Simplifying MEMS pressure sensor technology
Revolutionising electronics
Desktop printing on a nanoscale
20 Desktop printing can process semiconductors on the nanoscale
Features, News Review, Industry Analysis, Research News and much more. Free Weekly E News round up , go to
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Front Cover SiS
v1.indd 1 18/09/2013 14:17
Magazine and Front Cover designed by Mitch Gaynor
22 Era of atomic-scale semiconductor devices 24 Scotch tape makes electronic devices smaller and better
34 Issue IV 2013
www.siliconsemiconductor.net 5 26
contents CONNECTING THE SILICON SEMICONDUCTOR COMMUNITY 16
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