Backplane Connectors High Speed
Product Name Description
The Impact™ backplane connector system for con- ventional, coplanar and mezzanine configurations provides data rates up to 25 Gbps and superior signal density up to 80 differential pairs per inch. Achieve low cross-talk and high signal bandwidth while minimising channel-performance variation across every differential pair within the system.
Impact™ GBX I-Trac™
GBX I-Trac™ system, available in standard backplane, Orthogonal midplane, high-current power modules, Inverted and Coplanar configurations provides design flexibility and enables future system performance upgrades without requiring platform re-design. Capable of supporting next-generation applications with data rates of 12.5 Gbps or higher.
The Z-PACK TinMan’s press-fit, flexible, mono-block based system can be stacked end-to-end to meet customer pin-count requirements. The system delivers integrated shielding, differential-pair density, 85 Ohm impedance and lower crosstalk and insertion loss versus 100 Ohm backplane systems.
Z-PACK TinMan* *Z-PACK and Z-PACK TinMan are trademarks of Tyco Electronics GbX® backplane connectors deliver high-density and
high-speeds up to 10 Gbps and are custom-configurable. Bifurcated contact beams in daughtercard receptacles ensure greater reliability with 2 points of contact to each header pin. †
GbX® GbX®†
Very High Density Metric connectors achieve high- speed signal integrity via interstitial signal and ground shields between columns. Standard VHDM®
support data rates of 3.125 Gbps with less than 5% crosstalk; H-series supports up to 6.25 Gbps.
*VHDM is a registered trademark of Amphenol Corporation VHDM® * The High Density Metric (HDM® *) connector system suits HDM®*
applications that require high interconnect density and high-speed signal integrity. Daughter card modules are combined on a metal stiffner enabling very high circuit count assemblies to be handled as one connector. Power, guidance and coding function modules are also available.
*HDM is a registered trademark of Amphenol Corporation
MicroTCA™ delivers a low-cost, flexible and scaleable solution with 10.0 Gbps data rate for a wide variety of low to mid-range telecom applications. This press-fit, vertical, edge-card connector provides 170 contacts on 0.75mm pitch and enables AdvancedMC (AMC) cards to be plugged directly to a backplane.
MicroTCA™ N/A
30 Contacts/ CM
Right Angle Vertical
• Networking is a registered trademark of Amphenol Corporation 10 Gbps 69 diff pair / sq inch
Conven Coplanar Orthog
• Data Communications • Medical • Networking • Telecommunications
Speed Density Orientation Applications
25 Gbps
80 diff pair / sq inch
Conven Coplanar Mezz
• Data Communications • Telecommunications • Military/Aerospace
12.5 Gpbs
69 diff pair / sq inch
Conven Coplanar Inverted Orthog
• Networking • Telecommunications
12.5 Gbps
66 diff pair / sq inch
Conven Mezz
• Data Communications • Medical • Networking • Telecommunications
* connectors Up to 100 diff 6.25 Gbps pair / sq inch
Conven Coplanar
• Data Communications • Industrial Automation • Medical • Military/Aerospace • Networking • Telecommunications
10Gbps
N/A
Card Edge
• Medical • Instrumentation • Telecommunications
30
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