Volume: 21 No: 5 22 No: 1 SEPT/OCT 203
JAN/FEB 20114
LIATODAY THE OFFICIAL NEWSLETTER OF THE LASER INSTITUTE OF AMERICA
ICALEO 2014: THE PREMIER CONFERENCE FOR WORLD-CLASS
LASER RESEARCH PG 6
DICING OF THIN SI WAFERS WITH A PICOSECOND LASER ABLATION
PROCESS PG 10
INTRODUCTION TO LASER
MICROMANUFACTURING PG 14
Science & Research
Photo Source: Amplitude Systemes - Ultrafast Laser Material Processing of Semiconductor Wafers Laser Institute of America is the
Laser Institute of America, the international society dedicated to fostering lasers, laser applications and laser safety worldwide.
13501 Ingenuity Drive, Suite 128 Orlando, FL 32826
Phone: +1.407.380.1553
www.lia.org
Science & Research FOCUS:
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