Volume: 21 No: 5 22 No: 1 SEPT/OCT 203


JAN/FEB 20114


LIATODAY THE OFFICIAL NEWSLETTER OF THE LASER INSTITUTE OF AMERICA


ICALEO 2014: THE PREMIER CONFERENCE FOR WORLD-CLASS


LASER RESEARCH PG 6


DICING OF THIN SI WAFERS WITH A PICOSECOND LASER ABLATION


PROCESS PG 10


INTRODUCTION TO LASER


MICROMANUFACTURING PG 14


Science & Research


Photo Source: Amplitude Systemes - Ultrafast Laser Material Processing of Semiconductor Wafers Laser Institute of America is the


Laser Institute of America, the international society dedicated to fostering lasers, laser applications and laser safety worldwide.


13501 Ingenuity Drive, Suite 128 Orlando, FL 32826


Phone: +1.407.380.1553 www.lia.org


Science & Research FOCUS:


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