Laser Insights Featured Abstracts
Laser Insights is a feature to give insight into the very latest developments in laser safety and the possible applications of laser materials processing. These overviews are designed to give you insight into the content and applications of the papers presented at our conferences and workshops. Visit
www.lia.org/laserinsights to begin your search. View complete articles of the abstracts below online under the Featured Category.
High Density Through Glass Vias for Advanced Chip Packaging
BY RALPH DELMDAHL, RAINER PÄTZEL, ROLF SENCZUK AND JAN BRUNE Glass is a promising material from which advanced interposers for high density electrical interconnects for 2.5D and 3D chip packaging can be produced. The supply of ultra-thin glass wafers with thicknesses of 100 μm and below shows attractive cost and superior high frequency performance relative to polished thin wafers made of silicon. As thin glass is extremely brittle, micromachining to create through glass vias is particularly challenging and laser processing using deep UV excimer lasers at a wavelength of 193 nm and ultrashort pulse laser provide a viable solution.
The excimer laser has become a preferred technology in microelectronics manufacturing because it offers substantial advantages over alternative technologies. In particular, its non-contact nature and scalable output power enables the production of small, high precision features on a wide variety of materials.
The Novel Technology for Thick Glass Cutting with Small Power Laser Saw
BY CHAO HUANG, JIMIN CHEN AND SHI BAI
In recent years, glass has been widely used in different industrial cutting, sloped cutting and drilling. In this study, we developed a so called “laser saw” technology. With this technology, the laser Not only can it cut irregular shapes but it can also realize sloped cutting which means the cutting section is not perpendicular to the glass surface.
The focused pulse laser beam makes a reciprocating motion like a saw under the control of “laser saw” system. So that many micro crack dots were generated in the glass and they were connected to each other through the micro crack lines around dot. So that cutting face was generated in the glass.
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LIATODAY FOCUS: SCIENCE & RESEARCH SEPTEMBER/OCTOBER 2014
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