Title
Association & Institutes News Association & Institutes News
SMTA welcomes new board members Te SMTA is pleased to announce its elec-
tion results for the Board of Directors for the term that began at SMTA International (October 24-28, 2010). Michelle Ogihara, Seika Machinery,
Inc.; David Steele, Da-Tech Corporation; and Brian Toleno,
Ph.D, Henkel
Corporation; were elected to the Planning Committee. Marie Cole, IBM, was re- elected and now serves as Vice President of Technical Programs. Tose remaining on the SMTA Board of
Directors include: President, Dan Baldwin, Engent Inc.; VP Technical Programs, Marie Cole, IBM; VP Communications, Tom Forsythe, Kyzen Corporation; VP Membership, Roy Starks, Libra Industries; Treasurer, Hal Hendrickson, Nordson DAGE; and Secretary, Dr. Kola Akinade, Cisco Systems. Planning Committee mem- bers include: Chair, Jeff Kennedy, Celestica; Dr. Denis Barbini, Universal Instruments Corporation; and Dr. Ning-Cheng Lee, Indium Corporation. Te SMTA bids a fond farewell to
departing Directors Bill Barthel, Plexus Corp.; Joe Belmonte, ITM Consulting; and Dr. Laura Turbini, Research in Motion. Tey are congratulated for a job well done and given thanks for the years of dedica- tion to the SMTA. For more information on the SMTA
Board of Directors election results, contact SMTA administrator JoAnn Stromberg:
joann@smta.org or 952-920-7682.
SMTA International 2010 Best Papers Announced Te SMTA is pleased to announce the
Best Papers from SMTA International 2010. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achieve- ment, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper. Te winner from SMTA International
2010 for Best of Conference is Dave Hillman, Rockwell Collins, for his Lead- Free Symposium presentation entitled “NASA DoD -55 to +125 Termal Cycle Test Results.” Pradeep Lall, Rahul Vaidya, Vikrant
More, Auburn University; and Kai Goebel, NASA Ames Research Center, won the Best of Proceedings category for the paper “Interrogation of Damage-State in Lead-Free Electronics under Sequential Exposure to Termal Aging and Termal Cycling.” Craig Hamilton, John McMahon, Jose
Traya, Wang Yong Kang, and Khoo Kok Wei, Celestica Inc.; Matthew Kelly and Marie Cole, IBM Corporation won the Best International Paper category for the paper entitled “High Complexity Lead-Free Wave and Rework: the Effects of Material, Process and Board Design on Barrel Fill.” Te authors will formally be presented their awards at the Opening Ceremony during SMTA International in Fort Worth, Texas. For information on participating in the 2011 SMTA International Conference, visit the Call for Papers page at http://smta. org/smtai/
call_for_papers.cfm, or contact SMTA administrator
Perry, IPC technical project manager. Tis information is provided in the form of a comparison table that also includes CTE (coefficient of thermal expansion) data, dielectric constant, and Tg. Data on the relative cost of materi-
als as well as their capabilities in terms of dimensional stability, material consistency and other special processing has also been added to this table. Another new facet is the inclusion of
data that provides guidance for the toler- ances of printed board thickness, an area that hasn’t been addressed by the IPC document in many years. Helping design- ers address concerns about dimensional stability, the measurements are based on laminate to laminate thickness. Te toler- ances provided do not include any finishes or coatings and can help users avoid prob- lems such as bowing or twisting. Guidance on nonfunctioning lands,
which can pose problems in multilayer boards, is now a part of IPC-2222A. “We provide a table that explains why you may want to keep or remove nonfunctioning lands,” Perry says. “For example, if a number of nonfunctioning lands are removed from a board with many layers, inner layers may separate during z-axis expansion, causing reliability concerns.” Te standard also examines supported
IPC releases Revision A to IPC-2222 Design Standard IPC—Association Connecting Electronics Industries® has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more infor- mation on board materials, such as relative costs, tolerances of board thickness, unsup- ported holes, and hole aspect ratios. One of the biggest changes to the docu-
ment is the addition of a listing of the posi- tives and negatives of popular materials along with some of their performance char- acteristics. “Having the advantages and dis- advantages of common laminates spelled out will help printed board designers select a suitable laminate material,” explains John
72 – Global SMT & Packaging – February 2011
and unsupported holes. Tolerances are pro- vided for diameters of unsupported holes, such as those used to provide clearance for mounting hardware. Tere’s also a guide for the aspect ratio of holes. Tis latter section provides guidance on the ability to produce holes of specific diameters in relation to the thickness of the printed board. “Aspect ratio plays a key part in the ability of the printed board fabricator to provide suf- ficient plating along the barrel of a plated hole,” Perry said. IPC members may request a free sin-
gle-user download of IPC-2222 by sending an e-mail to MemberTechRequests@ipc. org within 90 days of the document’s pub- lication date. Aſter that date, IPC members may purchase the standard for $36. Te non-member price is $72. For more infor- mation or to purchase IPC-2222A, visit
www.ipc.org/2222.
www.globalsmt.net
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