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Thermal conductivity | additives feature Armin Kayser of ESK ceramics introduces a new generation of


hexagonal boron nitride fillers for producing thermally-conductive compounds that are also electrically-insulating


raising thermal conductivity with hexagonal boron nitride


Thermoplastic compounders are facing new challenges and opportunities in high-volume end-user markets, such as lEd systems plus vehicle electric drive systems and batteries. However, for many applications in these markets, metal replacement will only be possible if injection moulded parts can offer sufficient thermal conductivity. So far, design engineers have either used cast metal housings where high thermal flux is necessary, or standard polymer compounds for applications with low energy density [7]


. However, new high-volume technolo-


gies require both: highly-integrated housings, sub- strates and heat sinks with efficient thermal manage- ment and low system costs in mass production.


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The market entry of thermally conductive com- pounds in the past has been hindered by a number of factors: 1. it is only in recent years that the oEm market has demanded such solutions


2. There are processing challenges when using thermally conductive fillers 3. The requirements for thermal conductivity were unrealistically and unnecessarily high in the early development steps


4. last but not least, the high costs of filler materials and thermally conductive compounds The first obstacle fell when manufacturers of lEds and high-power electronic components, for example for


February 2012 | compounding world 25


Fig. 1: SEM of boron nitride


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