Hamamatsu Photonics Time Delay Integration (TDI) Technology
Hamamatsu Photonics new generation of TDI back thinned image sensors simultaneously solve issues of speed, sensitivity and resolution typically found in traditional line scan CCD based systems.
Ordinarily, high speed imaging systems suffer from a lack of available light and special illumination systems need to be constructed. Using a TDI camera with a 128 pixel height, it is possible to synchronise charge transfer with the moving object, thus giving 128 times the image integration time of a conventional line sensor. When charges are readout from the CCD, the sensor vertically transfers the charges line by line. If the charge transfer speed and the object speed are perfectly matched, it enables exposure time to be as long as the charge transfer time of the vertical stages in the CCD. When combined with the high sensitivity of the back thinned CCD chip, the TDI method results in an output two or three orders of magnitude greater than any regular line scan camera.
TDI systems are particularly useful for low light level scanning applications for which a typical linescan camera image has poor signal to noise ratio. Due to the great spectral response of Hamamatsu’s unique back thinned TDI sensors from UV to NIR, TDI is an excellent method for the inspection of large solar panels by electroluminescence or photoluminescence signal detection in the NIR range.
TDI is a well known and established technology in the field of machine vision applications for industry inspection. This technology is more beneficial when the application requires high throughput imaging which could not be reached by conventional imaging techniques.
For further information, contact us on: freephone: 00 800 800 800 88
Email:
Europe@hamamatsu.com or visit our website:
www.sales.hamamatsu.com
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