Feature: Sustainable Solutions
MAX16169, having nanoampere standby current ratings can be used as seen in Figure 1. Once the push-button is asserted, the
battery will be connected to the load. For instance, in Figure 1, the battery will be connected to the microcontroller (MCU), secure digital (SD) module, and global positioning system (GPS) module. Additionally, the sleep mode feature as found in the MAX16163/MAX16164 can be enabled to further extend battery life. It cyclically turns the system on and off for a specific time, allowing devices in the system to periodically wake up, complete tasks, and then return to sleep mode. Tis feature is particularly useful in wireless monitoring applications such as the Internet of Tings (IoT) where devices operate intermittently. By reducing power consumption during standby, overall efficiency is improved. Figure 2 shows how power consumption is reduced during sleep mode, indicated by the SLEEP_ TIMER state where the ACTIVE_STATE occurs when the battery is connected to the system, such as in Figure 1.
Dematerialisation Through Integrated Solutions Te best practices in PCB manufacturing involve responsible resource management. Tis includes dematerialisation measures to use fewer, smaller and lighter components in a power supply. Tis can be done by selecting components that contain several features into one package, reducing the amount of PCB footprint required, in turn, saving energy in manufacturing the end product. For instance, Figure 3 shows how the load switch and push- button debouncer features are combined in the MAX16150 and MAX16169 while the MAX16163/MAX16164 have an additional timing functionality. Note that the MAX16150 and MAX16169 have comparable block diagrams. Moreover, Figure 4 shows how an
integrated solution has improved the conventional approach to deep sleep mode and ship mode, which typically use a real- time clock, load switch and push-button controller. Te MAX16163/MAX16164 integrated solution was not only able to
Figure 2. Sleep mode current consumption
Table 1. Peak Current Comparison of HBM and IEC 61000-4-2 ESD Test Methods
reduce the solution size by 60 per cent but also provide 20 per cent longer battery life with the same functionality.
Improving System-Level Robustness Through High ESD- Rated Components Incorporating electrostatic discharge (ESD) protection circuits in an integrated circuit is crucial for ensuring reliability in harsh environments. Tese circuits need to operate continuously and stably, thus, requiring adequate protection against external surges. System designers
consider ESD test methods such as the human body model (HBM) for component-level ESD testing and the IEC 61000-4-2 model for system-level testing. Component-level ESD test methods are
conducted to ensure the IC can withstand the manufacturing process. Te HBM simulates a scenario where a charged human body touches the IC, discharging a potentially destructive ESD through the IC to the ground. System-level ESD tests aim to ensure that the device can survive transient events during various operating conditions in real-world applications,
www.electronicsworld.co.uk October 2024 33
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