Technology
Magnachip introduces 25 new Gen6 SJ MOSFETS to expand power product line-up for AI, industrial applications
Introducing 25 new Gen6 SJ MOSFETs with improved specific on-resistance (RSP), faster switching speeds and enhanced electrostatic discharge (ESD) protection. Magnachip Semiconductor Corporation
(‘Magnachip’ or ‘Company’) (NYSE: MX) announced a significant expansion of its product lineup with the launch of 25 new 6th-generation (Gen6) SJ MOSFETs (Super Junction Metal-Oxide-Semiconductor Field-Effect Transistors). The switching speeds of the newly
developed Gen6 SJ MOSFETs have been improved by approximately 23 per cent, reducing the RSP of applications by about 40 per cent compared to the previous generation, thereby enhancing the Figure of Merit by 40 per cent. Additionally, a Zener diode is embedded
between the gate and source to enhance reliability and protect the SJ MOSFETs from ESD-induced damage. The chip sizes of the new products are also approximately 30 per cent smaller than their predecessor product. The new product lineup consists of 600V, 650V and 700V voltage ratings and
is available in 7 package types, including TO220, TO220FT, SOT223, PDFN88 and D2PAK, with high-demand options, such as DPAK and TO220F. As a result, these SJ MOSFETs are well-
suited for various applications requiring high power efficiency, including AI TVs, smart refrigerators, AI laptop adapters and power supplies. According to market research firm Omdia, the global smart home device market is projected to grow by 20 per cent annually from 2025 to 2028. “With the successful launch of 25
new Gen6 SJ MOSFETs integrating Magnachip’s latest technology, we have further strengthened our product lineup to meet our customers’ evolving technical requirements,” said YJ Kim, CEO of Magnachip. “By delivering optimal power solutions for the AI, industrial applications and smart home appliances, we aim to contribute to the growth and success of our customers in these sectors, and further advance our technology and market leadership as we transition to a pure-play Power company.”
Silicon Labs unveils BG29: The future of Bluetooth LE in miniature devices
Ultra-small BG29 with expanded memory and ultra-low power is ideal for Connected Health devices. Silicon Labs, the leading innovator in
low-power wireless, announced its new Series 2 BG29 family of wireless SoCs, designed to bring high compute and connectivity to the smallest form factor Bluetooth Low Energy (LE) devices without compromising performance. BG29 is ideal for today’s most intensive Bluetooth LE applications like wearable health and medical devices, asset trackers and battery-powered sensors. Te BG29 is available in compact quad
flat no-lead (QFN) and wafer-level chip scale packages (WLCSP), featuring substantial memory with significant RAM and Flash capacities. Tese extended memory resources enable advanced applications such as real-time data processing, complex algorithm execution and high-speed communication protocols.
08 March 2025
www.electronicsworld.co.uk It features a DCDC boost for wide voltage
range support, a Coulomb counter for accurate battery monitoring and Silicon Labs Secure Vault High designed for PSA Level 3 to protect sensitive data.
Meeting the evolving needs of connected healthcare and medical devices Smart medical devices are transforming healthcare globally, but miniaturisation, building smaller connected devices without sacrificing performance or power, remains a key development obstacle. Te BG29 represents a significant breakthrough. It integrates high-performance wireless, long battery life, large memory capacity and multi-connection support in even the smallest devices, like blood glucose monitors, where it was previously extremely challenging. Te BG29 family of devices is expected to become generally available in Q3 of this year.
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