Advertorials New thermal interface materials


It is well known that air inclusions and device differences make the thermal contacting of different devices considerably more difficult, e.g. when connecting an electronic device on a heatsink. Production-related air cushions often arise in the gaps between the contact pairing, whereas the air is acting as a thermal insulator. However, the medium air is an extremely poor conductor of heat, which is why its influence must be eliminated in order to achieve thermally optimal heat transfer resistance. In particular to optimize these heat transfer resistances, Fischer Elektronik GmbH & Co. KG is expanding its already extensive product portfolio with additional new thermally conductive materials. The innovative and high-performance new products can be found in the fields of silicone thermally conductive foils, graphite foils, one-sided and double-sided adhesive thermally conductive foils, silicone-free gel thermally conductive foils, gel thermally conductive foils for extreme compression, liquid gel and phase change thermally conductive material. The total of 96 new articles from the named product ranges offer a material thickness range from 0.13 to 8mm with an associated thermal conductivity of 1.4 to 8 W / m*K, with the liquid gel and phase change thermally conductive materials covering a range of 1 , 8 to 5.5 W / m*K. All new products are UL 94 V-0 listed and have an operating temperature range from -60 °C to + 250 °C, depending on the product group, with graphite foils up to + 500 °C. The basic materials of the thermally conductive foils are available as sheet or roll material and can also be produced customer specifically by Fischer Elektronik as a part of a drawing. You can also use our free 24-hour sample service for individual cuts and contours according to your drawing specifications. The requested cut-to-size thermally conductive material is produced directly using a digital cutter with help of your CAD data in the form of a DXF file and shipped to you. The listed innovations from the product range of thermally conductive foils as well as all innovations from Fischer Elektronik can also be found at www.fischerelektronik.de


Rochester Electronics Provides End-to-end support for Ampleon’s LDMOS/VDMOS/GaN1 Power Transistors


Designers everywhere face a never-ending battle of managing the mismatch between their system’s lifecycle and the obsolescence of the components within it. The unique partnership between Ampleon and Rochester Electronics was established to provide our customers with a trusted long-term source for these critical RF devices. Recognizing that customers require a seamless transition, post-last-time-buy, to an authorised end-of-life manufacturing partner, Rochester’s current stock includes 150-part numbers of finished goods inventory along with wafer and die stock to provide continued licensed production. RF Designers can rest easier knowing that costly obsolescence-driven redesigns can be avoided, and that a blueprint exists for risk-free long-term support. Rochester Electronics is also the partner of choice for the long-term supply of both Active and end-of-life finished product for many of the world’s other leading RF manufacturers with over 225 million RF/ Microwave components in stock, comprised of 3,000-part numbers. Rochester provides true end-to-end support for the complete RF chain.


Find out more : www.rocelec.com +44.1480.408400


emeasales@rocelec.com


Smiths Interconnect receives contract from Mitsubishi Electronic Company to develop an integrated G-Band Satellite Based Antenna


system for the Japan Space Agency Development contract is part of the Global Observing SATellite for Greenhouse gases and Water cycle (GO- SAT-GW) program Smiths Interconnect, a leading provider of technically differentiated multi-function RF systems, subsystems, antennas, RF and MW components, connectors and cable assemblies for Aerospace and Defense, announced receipt of a contract from Mitsubishi Electric Corporation to participate in the development of a G-band satellite for the Japan Aerospace Exploration Agency (JAXA). Smiths Interconnect will design a component with dual band millimeter wave antenna and receivers as a part of the advanced microwave scanning radiometer 3 (AMSR3). The AMSR3 is designed to receive microwave radiation from the earth and will be mounted on the Global Observing SATellite for Greenhouse gases and Water cycle (GOSAT-GW). These microwave radiation measurements will assist in preventing disasters attributed to global warming and climate change, and to advance scientific and technological methods that enable more accurate prediction of climate change. The fully integrated antenna and receiver is an integral part of the system which will provide the frequency and the bandwidth that the GOSAT-GW mission requires.


Among very few companies with both millimeter wave component and subsystem expertise combined


with heritage in both space applications and antenna system design, Smiths Interconnect is uniquely positioned to provide first-class technical support and a reliable, lightweight, and compact system solution. ”We are proud to partner with Mitsubishi Electric Corporation and be a part of this important satellite


mission. Our extensive knowledge in the area of millimeter wave solutions for Space applications perfectly aligns us to support our customers’ current and future needs.” Said Ralph DeMarco, Vice President of Business Development and Sales at Smiths Interconnect Inc. www.smithsinterconnect.com


46 May 2021 Components in Electronics


New Miniature SMD PMS for 3D Printers and Industrial Systems


Hoofddorp, Netherlands, Tuesday, 11 May 2021 – Omron Electronic Components Europe has launched a new, exceptional- ly compact reflective photomicrosensor (PMS) with a sensing distance of 3-4mm, plugging a gap in the market for an SMD device addressing applications such as 3D printers, mini printers, e-locks and factory automation equipment. Gabriele Fulco, Product Marketing Manager for Sensors at Omron, said, “With increasing pressure on system size, there is a definite market trend to move from leaded PMS solutions to SMD, but there is a real need for a miniature device with a mid-range 3-4mm sensing distance. Our new device achieves a comparatively long sensing distance within a compact form factor as a result of its built in lens.” The new Omron EE-SY1201 reflective PMS is just 3mm x 4mm x 2mm – yet offers a peak sensing


The new Omron EE-SY1201 reflective PMS offers a peak sensing distance of 3mm


distance of 3mm. Typical applications include paper pass detection in mini-printers, pin or cylinder rotation in e-locks, media pass detection in cutting machines and filament rotation in 3D printers. Other uses include factory automation equipment and industrial cameras. For applications requiring a shorter sensing distance of just 0.5mm, Omron offers the EE-SY1200.


OMRON Electronics Components Europe B.V. Wegalaan 57, 2132 JD, Hoofddorp, The Netherlands Tel: +31 235 681 296, Fax: +31 235 681 222 Email: info-components-eu@omron.com Web: http://components.omron.eu LinkedIn page: https://www.linkedin.com/company/omron-electronic-components-europe-b-v-/


Advanced Interconnections


Let Advanced design a solution for your next project from our extensive toolbox of proven interconnect technology. We build from a solid foundation using screw-machined terminals and multi-finger contacts combined with a unique solder ball interface for surface mount applications that improve reliability across the board.


Advanced Interconnections Corp. designs and manufac- tures connectors for use on printed circuit boards in semiconductor development and high reliability electronic applications including military, automotive, and telecommu- nications. Prototype to production volumes are produced to customers’ requirements by an experienced team of over 70 employees and proudly shipped from Rhode Island to leading electronics manufacturers in over 35 countries around the world.


www.advanced.com


Embedded ARM Core Front Panel Solutions from ITRON (U.K.) LTD


Itron’s powerful ARM-9based embedded TFT modules provide serial interfaces to link host and peripheral devices using USB, RS232, Async, SPI, P2C, CAN and Ethernet. Most ports double up as general I/O with IRQ functionality.


Our embedded solutions allow design engineers to move application processing into the TFT module which reduces host overhead and enables easily manageable communication speeds. The host can send raw data to the TFT module for the opersting system to process and synchronise display refresh, navigstion and peripheral control.


For further details: The Sales Team, ITRON (U.K.) LTD +44 (0) 1493 601144 sales@noritake-itron.com www.noritake-itron.com


www.cieonline.co.uk


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