NEWS


Welcome to the April issue of Electronics for Engineers


I


have recently been researching Smart Technology innovations, due to inspiration drawn from our articles this month. Something which caught my eye was a bandage developed by the California Institute of Technology that is made from a fl exible printed circuit board. This stretchable plaster has the ability to detect whether an injury is healing well and, in order to aid this process, uses stimulating electrodes and microinjections of the appropriate medication. This has only been tested on animal subjects so far, but this product is certainly worth watching.


Making AI pervasive in space


Editor ynolan@datateam.co.uk


In our April issue, we will be covering a number of features in great depth, such as Distribution, Sensors, Optoelectronics, Interconnection, Manufacturing, Thermal Management & EMC, and Wearable Tech & Biometrics, as well as the aforementioned Smart Technology and IoT. Do feel free to contact me at ynolan@datateam.co.uk if you have any interest in submitting an article to the next issue, or with any feedback that you might have. It is always great to hear from our readers!


Ken O’Neill, Space Systems Architect, AMD


S


pace missions today must satisfy constantly increasing expectations for higher volume and quality data to inform activities such as climate studies, weather forecasting, geospatial mapping, and disaster mitigation. There is also growing interest in missions into deeper space that could hold the keys to the longer- term future of humankind and an even greater understanding of the wider universe.


E EDITOR Yasmin Nolan ynolan@datateam.co.uk


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Generally, today’s space vehicles are carrying higher- performing systems; examples include remote sensing satellites capturing photographs and video at ever-increasing resolution and with faster frame rates, or sampling greater numbers of multispectral and hyperspectral imaging channels. However, while the development of sensing applications has kept pace with the growing appetite for data, data-downlink bandwidths


generally have not. Bigger datasets imply lengthening exchanges with ground control stations. There is simply not enough time for this when the decisions that result from analysing the data are needed more quickly and sometimes even in real-time.


To mitigate the challenges of slow data-downlink bandwidths, more of the massive number crunching is moving into space systems. However, this demands much more powerful on-board computing payloads, raising the demand for energy and power, and also increasing payload weight, which must all be carefully managed when designing satellites and space vehicles.


On-board AI engines On-board AI compute engines in space-grade chips can offer a solution by permitting


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APRIL 2024 | ELECTRONICS FOR ENGINEERS


Yasmin No an


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