THERMAL MANAGEMENT & EMC


Ecosystem


collaboration for  cooling


By Giuseppe Forgione, sales director, regional strategic accounts at Vertiv


E


lectronics engineers and data centre designers face unprecedented thermal challenges as AI deployments scale rapidly. Established air-cooling systems,   graphics processing unit (GPU) accelerated  demand direct liquid cooling to maintain performance and reliability. Organisations across the infrastructure industry should    


The new AI data centre ecosystem AI is forging a fundamentally different        and operational hurdles in deploying thousands of GPUs at a pace that seemed impossible until recently.


    


12 MAY 2026 | ELECTRONICS FOR ENGINEERS


 further complexity, demanding infrastructure that can handle dynamic, multiuser, high- 


Logistics can become a bottleneck in     equipment - add another layer that demands meticulous coordination.


Thermal challenges in liquid- cooled AI deployments


 necessity. In air-cooled data centres, issues  temperature problems easily escalate to the operations team. High-density AI racks    helps the mechanical and electrical systems   installed.


      


designed to replicate the thermal and  By operating these load banks, engineers can stress-test the secondary loop at its   pressure drops across the manifolds and  responds correctly to rapid thermal changes.   


Key thermal management challenges to be 


Extreme heat removal at rack level, where AI GPUs generate heat densities that air       AI clusters is redirected for district heating   the data centre and external infrastructure,  these solutions as part of a complete, endtoend system.


Harmonic power distribution and variable loads from mixed training / inference workloads in multi-tenant sovereign 


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