• • • AUTOMATION • • •
Automating industry with mixed signal ASICs, SiP and SoC
Swindon Silicon Systems showcased the benefits of its custom integrated circuit solutions for optimum performance and supply security at the global SPS 2023 exhibition
windon Silicon Systems, the mixed signal Application Specific Integrated Circuits (ASICs) design and supply specialist, shared its approach to engineering customer- specific integrated circuit solutions with SPS’ 40,000 attendees. The exhibition, took place from November 14 to 16 at the Nuremberg Messe in Germany, SPS is a highlight in calendars across industry, representing the complete spectrum of smart and digital automation.
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This year marked Swindon Silicon Systems, a Sensata Technologies company, first time exhibiting at the conference, which welcomes visitors and exhibitors from across the globe each year. The conference focused on topics such as sensor technology solutions, electric drives and interface technology to leaders from the industrial management and production sectors. The team discussed the future of smart and digital automation and how its solutions can support transformation.
Throughout the event, Swindon was on hand to consult attendees who were looking to realise the benefits of custom ASICs. These circuits are designed for a specific application and provide optimised performance and power consumption versus off-the-shelf ICs.
Custom ASICs protect customers’ Intellectual
Property (IP) as they are extremely challenging to re-engineer or reuse in other applications. Another strength is the guarantee that the device will be available throughout the customers’ product lifespan, reducing the risk of obsolescence.
In addition to its ASIC design and supply capabilities, Swindon also highlighted the technical and commercial advantages of System on Chip (SoC) and System in Package (SiP) technologies. SoCs include all aspects of the system on the same die, offering a high level of customisation while allowing manufacturers to benefit from higher integration. SiPs are typically used where it is commercially beneficial
to co-locate individual die, such as signal conditioning, microprocessor and RF communications, into a single package. This approach can assist in development timescales where third party IP, in die form, can be readily utilised.
As SPS covered the entire spectrum of smart automation, attendees not only discovered today’s most innovative solutions, but also explored the vision of fully integrated sensor systems. “We are currently in the midst of huge changes to manufacturing brought about by Industry 4.0,” explained Richard Mount, Director of Sales at Swindon Silicon Systems. “Exhibiting at SPS was a great opportunity to showcase how our custom ASICs improve efficiency, productivity and safety in today’s increasingly connected world. As the manufacturing industry gears up towards Industry 5.0, we strive to realise the link between man and machine by continuing to provide innovative connected systems.”
42 ELECTRICAL ENGINEERING • NOVEMBER 2023
electricalengineeringmagazine.co.uk
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