search.noResults

search.searching

dataCollection.invalidEmail
note.createNoteMessage

search.noResults

search.searching

orderForm.title

orderForm.productCode
orderForm.description
orderForm.quantity
orderForm.itemPrice
orderForm.price
orderForm.totalPrice
orderForm.deliveryDetails.billingAddress
orderForm.deliveryDetails.deliveryAddress
orderForm.noItems
MATERIALS | HIGH-TEMPERATURE PLASTICS


in the reflow process. Polyplastics says it has identified three stages of


Laser transmittance at 940 nm as a function of the sample thickness. Genestar’s transmittance is well above the lower limit for laser welding, Kuraray says


Another Japan-based ETP supplier, Polyplas-


tics, points to the success it is having in utilising computer-aided engineering (CAE) analysis to forecast part deformation during the reflow process when manufacturing connector parts made of its Laperos liquid crystal polymer. “LCP connectors are finding growing use in mobile devices such as smartphones and switches, along with automotive-related applications,” it says. LCP parts can expand considerably in the high-temperature conditions of the reflow process, and this can have an adverse effect on the flatness of the product, Polyplastics notes. “Since heat deformation can cause poor bonding as a result of insufficient soldering to the metal terminals, it is important to find ways to reduce heat deformation, particularly as the market sees growing demand for smaller connectors.” For this reason, it says, it looked to CAE and began considering design stage deformation forecasting for moulded articles


Flexural strength Flexural modulus Flexural strain


Temperature of deflection under load (1.8MPa)


Flammability


Minimum filling pressure of FPC connector type (*1)


Minimum filling pressure of FPC connector type (*2)


Test method ISO178 ISO178 ISO178


Unit MPa MPa %


°C -


deformation that can be forecasted by CAE analysis. These include post-moulding initial deformation (warpage), at-peak heat deformation mainly due to the effects of thermal expansion plus post-moulding shrinkage, and post-cooling deformation mainly attributed to the effects of thermal shrinkage. “Polyplastics will continue to work on the development of CAE analysis technology to improve its accuracy and expand its range of applicability,” says a representative. “By forecasting deformation in the design stage by using CAE, we can help engineers designing electronic components that have to pass through reflow know if poor bonding or product deforma- tion due to thermal deformation may happen with their current design,” he says. “It can also help [potential users in] automotive and other industries who are considering replacing metals with plastics that can stand high temperatures.” Comparing Laperos LCPs with one rival PPA,


DSM’s PA4T (which is also targeted at very small connectors, including USB Type-C), the Polyplastics representative says his company believes LCPs score in terms of high heat resistance and low coefficient of thermal expansion, high melt flow, and fast cycling. LCPs probably also score because historically


more connectors have been made with these polymers, so connector makers are more comfort- able using them. And once the choice has been made, it’s difficult to change it, since moulds de- signed for one type of these rival materials may need important modifications to run with another type. DSM in the past has said that PA4T, which has been approved by several global producers for use in USB Type-C connectors, “has a CTI well above


General properties of Polyplastics Laperos LCPs for connectors Property


E130i 220


15000 2.3


ISO75-1, 2 UL94


Polyplastics method MPa


280 V-0 140


E471i 195


E473i E480i 160


200 2.8 2.1


S471 S475 180


180


13500 11000 16000 12700 12500 2.5


2.0


265 V-0 110


Polyplastics method MPa No filling No filling


250 V-0 76


170


270 V-0 -


-


315 V-0 100


- 2.5


305 V-0 -


90


(*1)0.5 mm pitch, 30-pins arranged in 2 rows, 4 cavities, equal runner, one-point submarine gate (0.4 mm diam.), minimum thickness 0.18 mm (*2) As above, but minimum thickness 0.12 mm


34 INJECTION WORLD | September 2018 www.injectionworld.com


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62