ELECTRICAL AND ELECTRONIC | MATERIALS
compromising mechanical strength, because a high filler content may be required,” says Celanese. High-Dk Zenite LCPs are said to overcome the problem through a combination of a proprietary filler, compounding, and LCP resin technology. Staying with LCPs, Ensinger has a new com- pound for laser direct structuring (LDS): Tecacomp LCP LDS 1049426 black is designed for thin-walled 3D MID (Moulded Interconnect Device) compo- nents with very fine conductor paths. The supplier says the material is particularly suitable for high- frequency applications in the fields of industry automation, electronics (consumer, networks) and the automotive sector. “The requirements being placed on integrated
electronics components are increasing: on the one hand, installation spaces are getting smaller, while on the other, more and more functions are having to be accommodated even on micro-components,” says Thomas Wallner, Head of Sales and Marketing of Compounds at Ensinger. “5G is also increasing the frequency requirements for circuit carriers. Our new compound permits very good fine pitch performance and metallisation that is not too rough. Both these things are basic prerequisites for high-frequency applications. Tecacomp LCP LDS is also reflow-solderable up to 260°C.” Wallner says an innovative filler concept used in the new compound increases the reliability of the conductor structures when exposed to varying stresses, both climate-related and mechanical. The first achievement is a low level of moisture absorp- tion, and the second an adapted coefficient of thermal expansion (CTE) comparable to that of copper. Mineral fillers with a particle size of under 10µm permit very fine conductor path structures, so that very narrow pitch widths of less than 70 µm are made possible in 3D. “Beside the very wide range of solutions for the E&E markets we have now a very unique solution for the so-called ‘no-flame test’ which is already mandatory for many applications … and maybe electrical vehicles if they happen to be considered as unattended devices.” That’s according to Alexis Chopin, head of technology at, Eurostar Engineering Plastics. Compliance with the IEC 60335-1 standard for household appliance applications has always been
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challenging to achieve, due to stringent GWIT (Glow Wire Ignition Temperature, IEC 60695-2-13) requirements, Chopin says. “As a result, many halogenated flame retardant solutions are still in use for applications that need to pass this standard.” He says: “Eurostar has developed Starflam
PA630VNF3, a 30% glass-filled, easy-moulding PA6 with outstanding fire resistance in glow wire tests.” Chopin says the grade makes use of new flame
retardant synergies that make it possible to outperform current market solutions with a GWIT value of 800°C, exceeding the well-known “775°C” standard requirements. These results have been confirmed by the German VDE and two appliances manufacturers selected as industrial validation partners. This new technology is based on an additive package that is free of halogens, red phosphorous, zinc borate and antimony trioxide, and is fully compliant with restrictions of Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment (WEEE) directives. Mocom is the new name of the compounding business that was until recently a division of Albis Plastic. It has developed Altech PP, Tedur L PPS, and Alfater XL TPV compounds with very high purity to provide long service life and performance of fuel cell systems. The company says stationary fuel cell technology is playing an increasingly important role. “Converting electricity from renewable resources such as wind and solar power into “green” hydrogen, store it and converting it back into electrical power with no emission could be one of the main technologies of the future,” it says.
CLICK ON THE LINKS FOR MORE INFORMATION: �
www.dupont.com �
www.eurotec-ep.com �
www.basf.com �
www.polyplastics-global.com �
https://lanxess.com �
www.dsm.com �
www.ascendmaterials.com �
www.radicigroup.com �
https://akro-plastic.com �
www.celanese.com �
www.ensingerplastics.com �
www.eurostar-ep.com �
www.mocom.eu
October 2020 | INJECTION WORLD 57
Above:
Ensinger has a new LCP compound for 3D-MIDs
IMAGE: ENSINGER
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