PRODUCT DESIGN | MATERIALS
high modulus and ductility to enable lighter, thinner and stronger parts that advance design innovation and ease of use. “From smartphone cases to medical device housings and mass transit interior panels, there is an urgent need on the part of OEMs to replace metal and other traditional materials to reduce weight, expand design freedom and cut processing costs and complexity,” says Joshua Chiaw, Director of Compounds at SABIC. “Thermocomp HMD-D compounds not only avoid the drawbacks of metal, they also add value with breakthrough ductility performance and excellent stiffness, which open opportunities for use in a wide range of structural applications.” The company says that in order to achieve lighter weight and thinner geometries in structural applications, Thermocomp HMD-D compounds deliver high performance in key mechanical properties that previously were mutually exclusive. The materials
offer both better ductility and dimensional stability/ warpage control than other high-modulus PC- based materials. This distinctive combination of attributes allows, for example, the creation of thin-wall devices that may withstand stringent drop testing without cracking. The new compounds use special glass fibres that minimise warpage. Grades with different glass fibre loadings (10-50%) are available to meet various modulus requirements. Thermocomp HMD-D products also deliver good strength for metal replacement while reducing weight due to their low specific gravity. They provide an excellent surface appearance by minimising the floating of glass fibres to the surface and improved melt flow, which, unlike parts made with various competitive materials, are not affected by heat and moisture ageing. Together with good colour-matching capability and colour stability, these characteristics help manufacturers appeal to
Left: SABIC has introduced new Thermocomp HMD-D high modulus ductile glass-reinforced polycarbonate compounds with increased design freedom in consumer electronics applications
Networking Party Rock & Roll Hall of Fame
TO GET YOUR TICKETS NOW!* REGISTER HERE Thank you to our sponsor:
Have fun with your new business contacts at the ultimate networking party on May 8, 2019 at the Rock & Roll Hall of Fame.
The party ticket is $20 per person and will give you full access to this iconic venue with drinks and nibbles. Doors open at 7pm.
Brought to you by: Click here to find out more *Tickets are available to registered attendees of the exhibitions only. Bringing the global plastics industry together
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