CONDUCTIVE PLASTICS USA 2018 | EVENT PREVIEW
EMI and ESD The second day of the conference will commence with a review of some of the latest developments in the area of EMI (electromagnetic interference) and ESD management (electrostatic discharge). Elijah Grant, Product Development Engineer at RTP Company in the US, will open the session with some guidance on how to select a thermoplastic material for use in hazardous and ATEX environ- ments. Dr Dimitri Rousseaux, Composites and Compounds R&D Manger at Total Research & Technology in Belgium, will discuss the develop- ment and application of carbon nanotube modified compounds in ATEX and ESD applications. And Kari Alha, R&D Director at Premix in Finland, will speak about electrostatic discharge attenuation in electrically conductive carbon black loaded compounds.
Achieving high levels of electrical and thermal conductivity in plastics can require working with high filler loadings and very often needs careful dispersion and handling of additives. The confer- ence will consider how this can be achieved in compound preparation. Dr Paul Andersen, Process Engineering Consultant at Coperion in the US, will explain some of the difficulties that produc- ers of conductive plastics may face and detail some of the techniques that can be applied in twin screw compounding to overcome them. Then Slayton Altenburg, Application Specialist at Technical Process & Engineering (TPEI) will discuss com- pounding of conductive masterbatches using continuous mixer technology. The final session of Conductive Plastics is focused on the challenges of measuring thermal
Conductive Plastics USA will bring together a line-up of expert speakers including (from left, top) Lux Research Analyst Dr Xiao Zhong, Covestro Principal Engineer/FTR Manager Terry Davis, Quarzwerke Head of Marketing and Development Péter Sebö, OCSiAl Head of the Department of Polymer Materials and Vice President Dr Eugeniy Ilin, (bottom row) RTP Company Product Development Engineer Elijah Grant, Coperion Process Engineering Consultant Dr Paul Andersen, TPEI Application Specialist Slayton Altenburg, and AMI Magazines Editor-in-Chief Chris Smith
conductivity. Justin Wynn, Application Engineer Thermophysical Properties at TA Instruments-Wa- ters in the US, will detail the use of steady-state and flash diffusivity measurement techniques to measure out-of-plane and in-plane thermal conduc- tivity. Then Alex Makitka, Applications Manager at Linseis in the US, will bring the conference to a close with an explanation of the use of the transient hot bridge (THB) technique for high speed meas- urement of thermal conductivity in polymer pads and parts. Download the brochure
https://www.ami.international/events/event?Code=C892#8992
Are you a plastics industry expert looking to take your career in an exciting new direction?
AMI is seeking an expert in polymer technology to research and create compelling conference programmes for its expanding portfolio of highly respected events for the international plastics industry.
The Conference Producer role involves identifying key market trends, crafting focused agendas and securing high calibre speakers to attract large and influential global audiences. Candidates should have a broad knowledge of plastics materials and processes, have strong interpersonal skills, be highly organised with the ability to manage multiple projects and a keen, intellectually curious mind.
The successful candidate will join our large and experienced conference team based in Bristol, UK. They will receive training in conference production and have access to AMI’s extensive industry databases and receive support and guidance from our knowledgeable team of market consultants and magazine editors. The full-time role will involve some overseas travel.
Founded in 1986, AMI is a leading provider of information, market intelligence, and events for the global plastics industry, with offices in the UK and USA. Our teams of consultants, researchers, writers, and event organisers include many of the most respected experts in their fields.
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