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ADDITIVES | POLYAMIDES


to PA6 is not always possible but can be done in some cases through the smart addition of functional additives. He says the company’s SCONA impact modifiers and coupling agents for polyamide and polyamide blends can help improve the physical properties of PA6 while its BYK-MAX HS organic and inorganic heat stabiliser concentrates can improve thermostability at high temperature conditions, such as found in automotive under-the-hood applications. The new Creamid P series of PA6 compounds


Above: Creamid P PA6 compounds from Teknor- Apex can provide an alternative to PA66


phosphorous-based halogen free flame retardant displays better tracking resistance than an LCP (liquid crystal polymer) in such an application. In connectors that are to undergo a high-temper-


ature reflow soldering process, he says, DSM’s ForTii aromatic PPA is preferred as it displays much lower moisture absorption than the aliphatic Stanyl PA46. “The low moisture absorption together with its intrinsically high surface tension avoids the forma- tion of so-called ‘blisters’ during the high tempera- ture SMT [surface mount technology] reflow soldering process,” he explains. “In addition, the high moisture absorption of PA46 would deteriorate the signal integrity of high speed FAKRA [automo- tive] and HSD [high-speed data] connectors.” Brüggemann’s Bergmann says that E&E markets


are also increasingly demanding metal and halogen-free additive packages to avoid the risk of electrochemical corrosion in sensitive applications. He said the company plans to launch such a stabiliser system this year.


Matching PA66 Due to the recent and ongoing shortages of PA66, users are looking to upgrade the performance of PA6 to provide an alternative. “Tailor-made additives assist compounders and users in making this move, mainly by increasing long term heat stability and productivity,” says Bergmann. “Brug- golen TP-H1805 extends the heat stabilisation of PA6 up to 200°C. Combinations of Bruggolen P22 or TP-P1401 nucleating agents with TP-P1507 flow enhancer will lift PA6 to the productivity levels of PA66, as PA6 modified this way will match the short injection moulding cycle times of PA66. In addition, small amounts of TP-P1507 allow for increasing the glass fibre content by just 5% to make PA6 grades reach the same mechanical properties as PA66 without any sacrifice in flow properties,” he says. BYK’s Garlinsky says making a switch from PA66


60 COMPOUNDING WORLD | February 2020


from Teknor-Apex have been formulated for lower moisture uptake. The new compounds “absorb nearly one-third less water at saturation than standard grades, provide 15-25% improved tensile properties in the conditioned state, and exhibit higher flow and better surface characteristics, even in highly glass-filled formulations,” the company claims. The technology used to lower moisture uptake can also be used in PA6/66-based com- pounds. An advanced heat stabilisation formulation extends continuous use temperature. “The improved tensile properties of Creamid P compounds enable them to meet the demands of certain structural applications where, traditionally, PA6 compounds did not perform due to high moisture uptake,” said Markus Krippner, Director of New Business Development ETP. “In some cases, they may provide a practical alternative to polyam- ide 66 compounds as well.” The company intro- duced the first two Creamid P compounds, with 30% and 50% glass fibre content, last year. Designed to improve impact resistance and dimensional stablility of PA6 and 66 compounds, Olebond 7403 in one of a line of maleic anhydride- grafted PE-based polymer additives from Tisan. The three grades are formulated for operation at temperatures of -50°C, 0°C and ambient and are used at addition levels of 3-25%. They can be used in unfilled, filled and fibre reinforced compounds. The company says tests show the Olebond 7403 IM-C low temperature grade can increase impact strength of unfilled compounds by up to five times at a 10% addition level.


CLICK ON THE LINKS FOR MORE INFORMATION: � www.dsmep.com � www.brueggemann.com � www.clariant.com � www.lbf.fraunhofer.dewww.pinfa.euwww.icl-ip.com � www.byk.com � www.quarzwerke.com (HPF Mineral Engineers) � www.teknorapex.com � www.tisan.com.tr


www.compoundingworld.com


IMAGE: TEKNOR-APEX


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