MANAGEMENT | PROCESS CONTROL
Right: Real time local and remote data availability is a feature of Entek com- pounders, including its new high output HT72 model
by Entek last year. The company claims it provides a higher output rate in lbs/ hour and offers the highest free volume at 18 torque density of any twin-screw extruder currently on the market. The HT72 is designed for the commodity compounding and masterbatch industry, where customers require medium-to-large batch production sizes and high production rates are especially important. When coupled with the company’s new Vacuum Feed Technology (VFT), it is said to be able to drive throughputs even higher for processes which involve feeding low density fillers. The HT72 provides real-time monitoring on the Entek Dashboard with Overall Equipment Effective- ness (OEE) data provided at the machine or via remote monitoring and access from mobile devices. This is said to allow for quick reference to numerous statistics including oil life, quality, and vibration information — providing more data on how the extruder is running on a minute-by-minute basis. This data helps compounders keep track of monitoring the overall health of the machine, Entek says, as well as monitoring performance to see if it
is meeting defined parameters for output and efficiency, for example.
Dynamic processing According to Italian compounding extruder manufacturer Maris, Industry 4.0 represents a concept that is able to turn production into a leaner, more dynamic and more flexible process that provides improved efficiency and sustainability. It believes it will set users on the path to fully auto- mated and interconnected industrial production. The criteria for the application of Industry 4 principles vary, the company says, but the general guidelines applied to extrusion lines include: control by means of PLC (Programmable Logic Controllers); interconnectivity with factory informa-
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www.hpfminerals.com SILATHERM® – FILLERS FOR TOMORROW
Increased thermal conductivity of polymers and electrical insulating properties. Various application possibilities in innovative products: •
GAP filler
• • • • •
TIM material
Epoxy resin compounds LED socket and sensors Microprocessors, EMC, CCL Thermoplastic compounds
Hidden inside – Performance outside! PELLETISERS WIRE & CABLE
IMAGE: ENTEK
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