INSTRUMENTATION • ELECTRONICS
ideal for advanced packaging techniques like chiplet integration, allowing manufacturers to mix and match dies with different functions. However, D2W presents significant manufacturing challenges since it demands ultra-clean, particle-free surfaces and precise alignment, as any contamination or misalignment can lead to defects, significantly compromising bonding qualities. Despite these challenges, D2W
The chart analyses the performance of different hybrid bonding techniques
alignment and bonding relatively straightforward. With wafers always maintaining a round shape, the process can be optimised for high throughput, making it suitable for large-scale production. However, W2W bonding is less flexible in handling different chip sizes and is limited by the need to bond identical wafers. On the other hand, D2W hybrid
bonding is more complex and addresses the limitations of W2W when dealing with high-performance dies of different sizes. Instead of bonding entire wafers, D2W involves the precise bonding of individual dies onto a target wafer, enabling the integration of different die sizes and types in a single package. This flexibility makes D2W bonding
bonding’s flexibility and precision are increasingly critical for high- performance applications, while integrated hybrid bonding tools are emerging to address many of these hurdles. IDTechEx’s report provides further insights into the materials and processing techniques employed in advanced semiconductor packaging, as well as a 10-year market forecast.
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WORLD. LEADING. INDUSTRYSHOW.
HANNOVER MESSE 2025
31 March – 4 April 2025 Hannover, Germany
hannovermesse.com
FUTURE WITH TECHNOLOGY
SHAPING THE
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