letter from the editor Compounding World goes global
We’ve been bowled over by the positive reaction to our Compounding World Forum in Philadelphia. The second event took place in December, attracting over 300 attendees and lots of very enthusiastic feedback.
From a personal point of view, I’ve really enjoyed the opportunity to connect with a wide range of readers and discuss key market and technology trends in a live forum. So I’m delighted to announce that we will be launching similar events in Europe and Asia this year – Cologne in April and Singapore in October – before returning to Philadelphia in December.
Compounders converge on Cologne: The programme for the Compound- ing World Congress 2015, which takes place in Cologne, Germany on 21-23 April, was published recently and is generating lots of interest. More than 180 people and 25 exhibitors are already signed up to attend. You can read the second part of our preview of the event starting on page 43 of this issue.
Singapore launch and call-for-papers: We have just confi rmed the dates for the fi rst Compounding World Asia event, which will take place in Singapore on 6-8 October. The programme for this conference is currently being compiled and we have issued a call for papers. If you are interested in giving a presentation, then full details of what we are looking for can be found at:
http://bit.ly/CWACFP.
Making plans for Philadelphia: Last but not least, plans are already underway for the third Compounding World Forum, which will take place on 8-9 December in Philadelphia. Places are already selling fast and the exhibition area is starting to fi ll up. We are also inviting submissions of papers for this event. If you are keen to give a presentation, then the call-for-papers is at:
http://bit.ly/CWFCFP.
Meet us on our travels: Details of these three events can be found at
www.amiconferences.com. We hope that you’ll be able to join us at one of them. I’ll also be out and about next month at the Masterbatch Asia conference in Singapore and at NPE in Florida. Plus there’s our new Conductive Plastics conference in Düsseldorf to look forward to this summer.
Now, where did I put my passport?
Andy Beevers Editor, Compounding World, and Head of Business Publishing, AMI
abe@amiplastics.com
www.compoundingworld.com February 2015 | COMPOUNDING WORLD 5
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