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Next Month’s Focus:


Manufacturing Services


Send News Releases for:


SMTCONNECT, EDS and EWPTE


VOLUME 36 - NUMBER 3


Product Preview: APEC


March, 2020


Breakthrough in Microscopy Shows Samples in Full View


Cornell Dubilier Electronics expands offering of high-cur- rent AC harmonic filter ca- pacitors. Product previews begin on…


X-Ray Inspection Page 76


East/West Relies on Glenbrook


Mansfield, CT — While traditional microscopy techniques allow minis- cule details to come into view, stan- dard equipment does not provide the user with the entire picture. Most op-


tical microscopes have a limited field of view — one or two millimeters. This is a distinct disadvantage for life scientists and pathologists who rely on microscopy to analyze and di-


agnose diseases, since prepared tis- sue samples have dimensions in the centimeter range.


Going Lensless A new microscopy platform de-


veloped by Guoan Zheng, professor of biomedical engineering at the University of Connecticut, removes a central component of traditional microscopes — objective lenses. By going lensless, researchers can pro- vide clinicians a more complete pic- ture, leading to more accurate diag- noses. This new platform eliminates


East/West Manufacturing us- es Glenbrook's Jewel Box to verify the integrity of minus- cule solder joints. EMS section begins on…


Page 18 This Month’s Focus:


Test and Inspection


several of the most common problems with conventional optical microscopy and provides a low-cost option for the diagnosis of diseases. Rather than us- ing lenses to magnify the tissue sam- ple, Zheng’s platform relies on a dif- fuser between the specimen and the image sensor or camera. The diffuser moves randomly to


Shaowei Jiang, UConn graduate student, poses with a newly developed platform for microscopy that eliminates the need for lenses (Credit: Christie Wang/UConn).


UIC’s APL Tackles Next-Gen Tech Challenges


By George Westby


BTU leverages vacuum reflow to reduce voiding; ATEQ devel- ops method of automotive bat- tery leak testing; Nordson SONOSCAN uses acoustic im- aging to examine a ceramic pressure sensor. Special fea- tures begin on…


Page 64


Conklin, NY —Founded more than 30 years ago, Universal Instruments Corporation’s (UIC) Advanced Pro - cess Lab (APL) leverages extensive process and materials expertise to ad- dress current and next-generation technology challenges. The APL offers comprehensive research, analytical and advanced assembly services that enable manufacturers to realize rapid product introduction, maximize yield and optimize reliability. The lab also plays a leading role in the greater electronics communi-


ty, organizing research consortia and building partnerships with aca- demic and industry experts to identi- fy and develop new and emerging technologies. It provides three key services: advanced technology as- sembly services, analytical services and the AREA Consortium.


Advanced Technology Assembly Assembly process performance


is crucial to profitability and market reputation. Whether a customer is looking to refine their current pro - cesses or effectively integrate new products, Universal’s APL will imple- ment possible designs, development and volume production solutions. Next-generation applications,


such as flip chip, system-in-package (SiP) and package-on-package (PoP) are accommodated by the APL. The company’s experts will maximize ef- ficiency, throughput, yield, and qual- ity, ensuring targets are met quickly and quality products are consistently brought to market.


Continued on page 6


different positions, while the sensor acquires the images, gathering the encoded object information that will later be used to recover an image for viewing by clinicians or researchers.


Ptychographic Imaging At the heart of the object recov-


ery process is an imaging technique called ptychography. Ptychographic imaging typically uses a focused beam to illuminate a sample and


Continued on page 8


Ultra-Low Power Wi-Fi Connectivity


San Diego, CA — More portable, ful- ly wireless smart home setups. Low- er power wearables. Batteryless smart devices. These could all be made possible by a new, ultra-low power Wi-Fi radio developed by elec- trical engineers at the University of California San Diego. The device, which is housed in a


chip only 0.0023 in.2 (1.5 mm2) in size, enables Internet of Things (IoT) de- vices to communicate with existing Wi-Fi networks using 5,000 times less power than today’s Wi-Fi radios. It consumes just 28 µW of power and does so while transmitting data at a rate of 2 Mb/s (a connection fast enough to stream music and most


Continued on page 8


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