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Next Month’s Focus:


SMT and Production


Send News Releases for:


NEPCON Asia and


SMTconnect/PCIM (Virtual)


VOLUME 36 - NUMBER 7 EM Products


PVA's benchtop coating/dis- pensing system is suitable for virtually any workbench or laboratory selective coating or automated dispensing appli- cation. Electronics manufac- turing products begin on…


EM Services Page 24


July, 2020


Self-Powered “Paper Chips” Could Help Fight Wildfires


Washington D.C. — Recent devastat- ing fires in the Amazon rainforest and the Australian bush, as well as the regular wildfires on the west coast of the U.S., highlight the need for fire detection before they blaze


out of control.


Current methods include infrared imaging satellites, remote sensing, watchtowers, and aerial patrols, but by the time they sound the alarm, it could be too late. Now, researchers re-


porting in ACS Applied Materials & Interfaces have developed self-pow- ered “paper chips” that sense early fires and relay a signal.


Previously, scientists have pro- posed placing a network of sensors in the forest that could detect changes in temperature, smoke or humidity and wirelessly transmit a signal to respon- ders. However, such a system has not yet seemed practical, because all the sensing components need power. Batteries would eventually go dead and need to be replaced. Ther- moelectric materials, which convert temperature differences into electric- ity, could simultaneously detect tem- perature increases from fires and power themselves.


CTM Lyng AS installs ASM's integrated smart factory E-So- lutions, boosting throughput and quality of its smart home products. EMS section begins on…


Page 18 This Month’s Focus:


Production and Packaging


Inset photo: high temperatures near inexpensive and self-powered chips, like the one attached to this houseplant, could wirelessly sig- nal wildfire alarms.


High-Throughput Vapor Phase Reflow


Clariant's humidity indicators were born out of the naval clashes in the South Pacific during WWII; MicroCare devel- ops specialized cleaning prod- ucts for fiber optics; Nordson SELECT reduces dross and sol- der balls in selective soldering. Special features begin on…


Page 46


Roswell, GA — Rehm Thermal Sys- tems has launched its CondensoX- Line Quad Core, which offers contin- uous vacuum processes and high rates of throughput. Many of today’s vapor phase soldering systems are limited by their process chambers. Rehm has developed continuous va- por phase soldering by combining the process with vacuum. This way, the pressure relative to the environment is influenced only in a closed cham- ber.


Still, conventional vapor phase soldering does not meet modern re-


quirements for throughput per pro- duction line. Rehm has met this chal- lenge by combining the advantages of vacuum soldering with vapor phase, allowing large quantities of product to be processed and reducing cycle times, in its CondensoX-Line Quad Core.


The new system allows four par- allel vacuum soldering processes to be performed in order to achieve both the highest possible throughput and continuous process operation during maintenance. Since the chambers can be operated individually and in- dependently, preventive mainte- nance can be performed on a single chamber without halting production. Each individual chamber contains both the vapor phase process and vacuum. The pressure values, as well as the temperature profile, can be adjusted during the entire process.


This has a few advantages, in- Continued on page 8


However, most of these materi- als are solid inorganic semiconduc- tors, which are often expensive, rigid and environmentally unfriendly. Yapei Wang and colleagues wanted to find out if ionic liquids could be used as thermoelectric materials for fire sensing. These fluids are salts in the liquid state, and two different types of ionic liquids can be connect- ed in series to generate signals.


Continued on page 8


The Optical Future of Computing


Santa Barbara, CA — The growing demands of data centers have pushed electrical input-output sys- tems to their physical limit, which has created a bottleneck. Maintain- ing growth will require a shift in how we built computers. The future is op- tical.


Over the last decade, the field of photonics has provided a solution to the chip-to-chip bandwidth problem in the electronic world by increasing the link distance between servers with higher bandwidth, far less ener- gy, and lower latency compared to electrical interconnects.


One element of this revolution, silicon photonics, was advanced fif- teen years ago when UC Santa Bar- bara and Intel demonstrated silicon laser technology. This has since trig- gered an explosion of this field. Intel is now delivering millions of silicon Continued on page 6


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