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Equipment and Accessories SECTION 27 EMS300R T (continued)
Rapid data entry At the operational heart of the EMS300R T is a simple color touch screen, which allows even the most inexperienced or occasional operator to rapidly enter and store their own process data. To further aid ease of use, a number of typical sputtering and carbon coating profiles are already stored. For added convenience summaries of the last 100 coatings carried out can be viewed.
The intuitive touch screen interface features maintenance prompts which highlight:
Time of last clean Coating time since last cleaned System ‘on time’ Time of last service
Improved Tolerance to Out Gassing Substrates The pump time out has been moved to a new level defined by "safe outgas
threshold" parameter, this is user definable between 5 x 10-2 and 2 mbar.
Until now the system would limit the time to achieve operational vac of 1 x 10-3
to 10 minutes. With the new modification once the "Safe outgas threshold" has been achieved the system will pump continuously. Implemented from software version 2-0042 onwards.
Controlled Evaporation Process
This process can automate a metal evaporation process when using low power evaporation sources. It can be used with the FTM.
The use of key properties about the source and required termination allow the process to:
Bring the source current up to the point of evaporation. Ramp the current up at a controlled rate until evaporation is seen.
Close the shutter and shut the evaporation PSU down when the specified thickness is seen.
Check the source for open or short circuit when starting the process.
This process will be available on the EMS150T with software version 2- 0048 or later. Consideration should be made to the thermal effects of the evaporation source when using the FTM to control the process.
Improvements to the Pulse Carbon Rod Evaporation Continued work on this process has found that the thickness deposited can
be variable if the power applied to the rods is either too high or too low. With the optimum current being a narrow margin between them. However, limiting the available voltage supplied to the rods increases this current window. This coupled with reducing the spigot diameter to work at a more optimum point in the PSU operation produces a more continuous spark which in turn produces a more repeatable thickness.
This improvement can be implemented by:
Software version 2-0046 or later implements the voltage limit. Note all the carbon rod profiles should be deleted if a unit is updated to this software version.
The evaporation current should be set between 60 and 65A.
The reduced spigot diamter of 1.2mm can be produced with the blue handle rod shaper.
EMS300R T standard specimen stage shown with a 4” wafer. Optional film thickness monitor (1152) fitted
Other options Extended height chamber – for taller specimens
Film thickness monitor (FTM) - this attachment consists of a controller and quartz crystal oscillator built into the EMS300R T and a vacuum feed-through, chamber-mounted crystal holder and quartz crystal. As sputtered or evaporated material is deposited onto the crystal, so its frequency of oscillation is modified. This ‘modification’ is used to measure and control the thickness of material deposited. Note: cannot be used when the coater is operated in “single target” mode.
Options and Accessories (including details the standard specimen stage)
The EMS300R T has specimen stages to meet most requirements. All are easy-change, drop-in style (no screws) and are height adjustable (except for the rotary planetary stage). Rotation speed is variable between preset limits:
Flat rotation stage for wafers - for 8”/203 mm and 6”/152 mm/wafers (fitted as standard)
Rotation stage – 50 mm Ø. This stage only rotates - no tilt or height adjustment is possible
Rotate-tilt stage – 50 mm Ø with height adjustment (target to stage height variable between 30-80 mm). Tilt angle can be pre- set (horizontal to 30 degrees)