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materials | ETPs


Comparison of storage modulus of Ultramid Advanced N with a corresponding PA66 (Dynamic- mechanical analysis, ISO 6721-7, tested dry as moulded)


Source: BASF


this grade is currently the only polyamide grade to have secured, in all product designs, the JEDEC MSL 1 (moisture sensitivity level 1) rating. This means that parts will not blister during high temperature soldering, even after being stored for long periods. Blistering is the result of the rapid conversion of


Moisture uptake test of BASF Ultramid Advanced N compared to PA6T (both 35% glass reinforced) at 70°C and 62% RH. Source: BASF


Right: DSM’s Konraad


Dullaert says


ForTii Ace is a gamechanger in metal


replacement


automotive die-cast metal replacement exhibit a significant drop in mechanical performance when operating at temperatures above 125°C, according to DSM. “This is not the case for ForTii Ace, so this is a massive improvement,” Dullaert says. ForTii Ace has a glass transition temperature (Tg) of 160°C, which is significantly higher than most other PPAs (including DSM’s existing ForTii grades) and at least 80°C higher than PA66. It also has higher resistance to various automotive oils and chemicals. ForTii Ace is also the only PPA with an aromatic content of over 50% by weight, Dullaert says. And with its combination of high Tg crystallinity and high Tg, the mechanical performance and the heat-aging perfor- mance of ForTii Ace are said to be superior to rival PPAs based on polyamides 6T, 9T and 10T. The ForTii Ace family will include grades with various types of fillers and reinforcements, including glass and carbon fibres at addition rates of up to 50%. Some grades of ForTii Ace will even provide cost-effective alternatives to polyetheretherketone (PEEK), in selected applications, Dullaert claims. A few days after K, at the Electronica trade fair for


electronic components, systems and applications in Munich in Germany, DSM unveiled ForTii Ace JTX8, a grade developed specifically for automotive electronic connectors. The company said prior to the show that


68 COMPOUNDING WORLD | April 2017


moisture in a part exposed to high temperatures to steam, which is unable to escape. It is a problem often associated with the typical high temperature polyamides commonly used for connectors suitable for reflow assembly. “The automotive industry is increasingly specifying a JEDEC MSL 1 rating in their requirements for reflow connectors,” says Rui Zhang, Marketing Manager Connected Car at DSM. “ForTii Ace JTX8, which meets these requirements whatever the thickness of the design, solves a long-standing dilemma in the industry.” Zhang says that several other types of thermoplas-


tics also comply with JEDEC MSL 1, but each has its limitations. “With current solutions in the market, a connector designer always needs to make a compro- mise to carefully design around the brittleness of the material, the weak weld lines, or the low peak tempera- ture resistance,” he says. This often means thick and bulky designs to cope with the low mechanics, or carefully specified the soldering conditions to reach a just acceptable end product performance. In addition to the JEDEC MSL1 perfor-


mance, DSM’s ForTii Ace JTX8 is also said to be an ideal match for automotive electron- ics applications in environments up to 200°C. Traditional solutions for these sorts of temperatures are typically materials stabilised with a copper iodide salt, but these additives can create corrosion issues on metal contacts. Removing the iodide-based stabiliser is possible, but the thermal stability of the compound is dramatically reduced, compro- mising its ability to withstand the thermal load in the application.


www.compoundingworld.com


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