TSSOP Thin Shrink Small Outline Package
The Thin Shrink Small Outline Package (TSSOP) offers smaller body sizes, smaller lead pitches and package thickness (0.9mm thick) than standard SOIC packages. Body widths are 3.0mm, 4.4mm and 6.1mm. Lead counts range from 8 to 80. This package conforms to JEDEC package outlines.
Part Description
A-TSSOP8T-3.0mm A-TSSOP8T-4.4mm A-TSSOP10T-3.0mm A-TSSOP14T-4.4mm A-TSSOP16T-4.4mm A-TSSOP20T-4.4mm A-TSSOP24T-4.4mm A-TSSOP28T-4.4mm A-TSSOP28T-6.1mm A-TSSOP44T-4.4mm A-TSSOP48T-6.1mm A-TSSOP56T-4.4mm A-TSSOP56T-6.1mm A-TSSOP64T-6.1mm A-TSSOP80T-6.1mm
Notes
0.9mm body thickness for 4.4 and 6.1mm body widths. 0.85mm body thickness for 3.0mm body width. JEDEC package outline is standard. High conductivity copper leadframes. Very low-stress mold compound. Tube quantity may vary. Parts available on Tape and Reel upon request.. Lead-free available with 100% Matte Sn alloy.
Number of Pins
8 8
10 14 16 20 24 28 28 44 48 56 56 64 80
TSSOP Thin Shrink Small Outline Package Pitch
Body Width
3.0mm 4.4mm 3.0mm 4.4mm 4.4mm 4.4mm 4.4mm 4.4mm 6.1mm 4.4mm 6.1mm 4.4mm 6.1mm 6.1mm 6.1mm
.65mm .65mm .5mm
.65mm .65mm .65mm .65mm .65mm .65mm .5mm .5mm .4mm .5mm .5mm .4mm
Tape Width
12mm
12/16mm 12mm
12/16mm 12/16mm 16mm 16mm 16mm 24mm 24mm 24mm 24mm 24mm N/A N/A
Tape Pitch
8mm 8mm 8mm 8mm 8mm
8/12mm 8/12mm 8/12mm 12mm 12mm 12mm 12mm 12mm N/A N/A
Part Description System Amkor
Thin Shrink Small Outline Package
Number of Pins Packaging Body Width
Add “T” for Tubes or “TR” for Tape and Reel to end of part number. Add “Sn” to end of part number for Lead-Free.
Quantity Per Tube
98
100 98 96 96 74 62 50 50 42 39 42 35 28 28
A-TSSOP8T-3.0mm-DC-Sn (100% Matte Sn) Daisy Chain
Quantity Per Reel
2,500
1,000/2,500 2,500
1,000/2,500 1,000/2,500 1,000/2,500 1,000/2,500 1,000 1,000 1,000 1,000 1,000 1,000 N/A N/A
TSSOP Package Mold
Au Wire Compound Cu Leadframe For recommended kit see page 94. Die
Die Attach Pad
Die Attach Adhesive
Practical Components, Inc. Tel: 1-714-252-0010 Fax: 1-714-252-0026
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