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(V)FQFP FusionQuad®


Amkor’s FusionQuad® represents a breakthrough in leadframe-based plas- tic packaging through the effective integration of ExposedPad™ QFP and MLF® technologies. FusionQuad® is based upon the addition of exposed bottom lands within a standard VQFP package format. The novel integra- tion of bottom lands provides a cost-effective platform for increased lead count in a small form factor. FusionQuad® not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50% reduction in package size for a given leadcount. Ad- ditionally, FusionQuad® provides excellent RF electrical performance char-


acteristics with short signal paths to the bottom lands and high power dissipation capability with the solderable exposed die attach paddle.


Amkor’s FusionQuad® provides an ideal package format for most IC semiconductor technologies including advanced mixed signal SoCs, motor drivers, MCUs, ASICs, DSPs and a variety of others. FusionQuad® is particularly well suited for applications requiring superior electrical or thermal performance in a cost constrained environment including hard disk drives, laptop PCs, Ethernet communication, digital television, data conversion and many others.


FusionQuad® Part Description


Single Row A-(V)FQFP176(128/48)-14mm-.4mm A-(V)FQFP184(128/56)-14mm-.4/.5mm A-(V)FQFP196(148/48)-16mm-.4/.5mm A-(V)FQFP220(148/72)-16mm-.4mm A-(V)FQFP280(224/56)-24mm-.4/.5mm A-(V)FQFP304(224/80)-24mm-.4mm


Dual Row A-(V)FQFP216(100/116)-14mm-.5mm


Total Lead Count


176 184 196 220 280 304


216


External Leads


128 128 148 148 224 224


100


Internal Leads


48 56 48 72 56 80


116 FusionQuad®—176 pin Single Row Design


Standard 14mm x 14mm VQFP 128LD 0.5mm External Lead Pitch


Mold Compound Die Cu Leadframe Exposed Lands


Additional 48 pins on bottom at 0.5mm Pitch


Order Number: A-VQFP176(128/48)-14mm-0.5-DC-Sn FusionQuad®—216 pin Dual Row Design


Standard 14mm x 14mm VQFP 100L 0.5mm External Lead Pitch


Mold Compound Die Cu Leadframe Exposed Lands


Exposed Die Paddle


Gold Wire


0.8mm Body


SOH: .05 nominal


Double Row Exposed Land Design


Additional 116 pins on bottom at 0.5mm Pitch


Order Number: A-VQFP216(100/116)-14mm-0.5-DC-Sn 50 For kits see pages 52, 53 and 93. Practical Components, Inc.  www.practicalcomponents.comklaphen@practicalcomponents.com


less than 1.00mm


Seat Height


Exposed Die Paddle


Single Row Exposed Land Design Gold Wire


0.8mm Body


SOH: .05 nominal


less than 1.00mm


Seat Height


Body Size


14mm sq 14mm sq 16mm sq 16mm sq 24mm sq 24mm sq


14mm sq


Body Thickness


.8mm .8mm .8mm .8mm


1.0mm 1.0mm


.8mm


Lead Pitch


.4mm


.4/.5mm .4/.5mm .4mm


.4/.5mm .4mm


.5mm


Quantity Per Tray


90 90 84 84 40 40


90


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