Industry Acronyms FPGA Field Programmable Gate Array
FRACAS Failure Reporting, Analysis and Corrective Action System FSDT FTA
First-order Shear Deformable Theory Fault Tree Analysis
FQFP GA
GAL GEM
GPWS HALT HASS HAST HBM HDL
HSDT HSOP HTCC HTOL HTRB HTS
HTTP I/O IC
IDDQ IDSA IDT IEC
IECQ
IEEE IFE
IGBT IMA IP
IPC IPD IR
IRC Isat ITO JAN JAR
JEDEC LCA
LCCC LC
LCD LCM LGA LIF
FusionQuad® Flat Pack Gate Array
Generic Array Logic/Lattice Generalized Emulation of Microcircuits
GIDEP Government Industry Data Exchange Program GPC
Government Procurement Committee Ground Proximity Warning System Highly Accelerated Life Test
Highly Accelerated Stress Screening Highly Accelerated Stress Test Human Body Model
Hardware Description Language
HDTV High Definition Television HM
Health Monitoring
Higher-order Shear Deformable Theory Small Outline Package with a Heat Sink High Temperature Cofired Ceramic High Temperature Operation Life High Temperature Reverse Bias High Temperature Storage Hyper-Text Transfer Protocol Input/Output
Integrated Circuit Quiescent Current
Incremental Damage Superposition Approach Integrated Device Technology
International Electrotechnical Commission
International Electrotechnical Commission Quality Assessment System for Electronic Components Institute of Electrical and Electronic Engineers In-Flight Entertainment
Integrated Gate Bipolar Transistor Integrated Modular Avionics Intellectual Property
Institute for Interconnecting and Packaging Electronic Circuit Integrated Passive Devices Infra Red/Insulation Resistance International Resistive Company Saturation Current Indium tin oxide Joint Army Navy
Joint Aviation Regulation
Joint Electron Device Engineering Council Logic Cell Array
Leadless Ceramic Chip Carrier Liquid Crystal
Liquid Crystal Display
Life Consumption Monitoring Land Grid Array
Low Insertion Force LIGA LM LOT
LPCC LRM LRU LSI LTB
LTOL
LVCES LVT
LWDT
Acronym from German words for lithography, electroplating, and molding Life Margin Life of Type
Leadless Plastic Chip Carrier Line Replaceable Module Line Replaceable Unit Large Scale Integration Last Time Buy
Low Temperature Operating Life
Low Volume Complex Electronic System Low Voltage (BiCMOS) Technology Layer-Wise Deformable Theory
MAX Multiple Array Matrix MBGA Metal Ball Grid Array MCM Multi-Chip Module MDRR Multi-Domain Rayleigh Ritz MDSDT Material Dependent Shear Deformable Theory MEMS MicroElectroMechanical Systems MFG
Mixed Flowing Gases
MFOP Maintenance Free Operating Period MLCC Multilayer Ceramic Capacitor MLD MM
Minimum Life Desired Machine Model
MMC Metal Matrix Composite Mn
Metal level number n
MOCA Mitigation of Obsolescence Cost Analysis MoL
Method of Lines
MoM Method of Moments MOS Metal Oxide Semiconductor MOSFET Metal Oxide Semiconductor Field Effect Transistor MRP MSL
Maintenance Recovery Period Moisture Sensitivity Level
MTBF Mean Time Between Failures MTBUR Mean Time Between Unscheduled Removals MTTF Mean Time to Failure NCMS National Center for Manufacturing Sciences NEC
Numerical Electromagnetic Code NEMI National Electronics Manufacturing Initiative Inc.
NEMP Nuclear Electromagnetic Pulse NFEM Nested Finite Element Method NFF NIF
No Fault Found Normal Insertion Force NRE
NSWC OEM OLED OOR PAL
PASIC PBGA PBT PC
Non-Recurring Engineering Naval Surface Warfare Center Original Equipment Manufacturer Organic Light Emitting Diodes Ordered Overall Range Programmable Array Logic
Programmable Application Specific Integrated Circuit Plastic Ball Grid Array
Parasitic Bipolar Transistor Pre-Conditioning
PC FAB Printed Circuit Fabrication
Courtesy of CALCE
www.calce.umd.edu 44 Practical Components, Inc.
www.practicalcomponents.com
klaphen@practicalcomponents.com
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