Flip Chip Test Die Kit


With an increasing number of I/O’s on Integrated Circuits and accompa- nying requirements for high performance, flip chip type components become a compelling technology for potential users. Flip Chip Technol- ogy test die are combined with factory designed test boards to provide


Laminate Board


Laminate board is double-sided. One side has 10 pads for the PB8-2x2 (the back side is no longer available for the PB8-4x6, this part has been discontinued).


Substrate Information


 Board Type—High Temp FR4  Board Thickness—0.062"


 Layers—4 (top, bottom, ground, power) inner layers nonfunctional


 Copper Conductor—1/4 oz. or 1/2 oz. Cu  Solder Mask—Taiyo PSR-4000


 Test Site Die—10 (200 x 200 mil2) sites on one side of the board


 Pitch—8mil  Minimum Line—4mil  Minimum Space—4 mil


 Wettable Cu Pad—4 x 8 mil2 (defined using a solder mask)


 Purpose— Flip Chip on FR-4 board with daisy-chain structure


Board for 400x400 die size is not available. Order Number: PB08-2x2-Laminate


Laminate Board


Laminate is only available for FA10-2x2. Single-sided pattern.


Substrate Information  Board Type—High Temp FR4  Board Thickness—0.031"


 Layers—4 (top, bottom, ground, power) inner layers nonfunctional


 Copper Conductor—1/4 oz. or 1/2 oz. Cu  Solder Mask—Taiyo PSR-4000


 Test Site Die—10 (200 x 200 mil2) sites on one side of the board


 Pitch—10 mil array  Minimum Line—4 mil; Minimum Space—4 mil  Wettable Cu Pad—5 mil diameter, round  Through-Hole Via—8 mil drill, 10 mil capture pad


Board for 400x400 die size is not available. Order Number: FA10-2x2-Laminate


Notes


 Board finish is Organic Solderability Preservative (OSP).OSP, also known as ENTEK® (CU-106A-HT), is a high performance, copper protective coating for use on printed wiring board, which replaces hot air solder leveling (HASL) and other metallic PWB surface finishes. ENTEK®


PLUS


maintains surface planarity and inhibits copper oxidation. Technical data is on file upon request.


 Digitized files provided by Aegis Software included at no charge. 42 Practical Components, Inc.  www.practicalcomponents.com  klaphen@practicalcomponents.com Board Size: 3.5" x 5.5"


customers the ability to test a variety of die specs, bump pitches and bump counts. Both components and test boards are daisy-chained for continuity.


Board Size: 3.5" x 5.5"


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