Flip Chips
Flip Chip describes the method of electrically connecting the die to the package carrier. The package carrier, either substrate or leadframe, then provides the connection from the die to the exterior of the package. The interconnection between die and carrier in flip chip packaging is made through a conductive bump that is placed directly on the die surface. The bumped die is then flipped over and placed face down, with the bumps connecting to the carrier. After the die is soldered, underfill is applied be- tween the die and the substrate, around the solder bumps. The underfill is designed to contract the stress in the solder joints caused by the differ- ence in thermal expansion between the silicon die and carrier.
Part Numbers:
FA10-200x200 FA10-400x400
Die Size 200 x 200 mils 400 x 400 mils
Bump Pitch 254 µm, 10 mil Passivation Via 80 µm UBM Diameter 102 µm Bump Height 120 µm Bump Diameter 135 µm No. of Bumps 317
Final Metal Pad Size Thickness Type 127 x 127 µm
Metal Composition 98/1/1 Al/Cu/Si Packaging Uncut Wafer* Tray 5" Wafer
200 x 200 mils (344Die) 400 x 400 mils (86 Die)
Sawed 5" Wafer 36 per tray 200 x 200 9 per tray 400 x 400 Waffle Pack
Tape and Reel Call For Availability
Notes
* Die count represents expected yield per wafer. All die is packaged in waffle pack trays unless otherwise specified.
All test wafers are currently 5" diameter and are 0.635mm thick. Passivation is one-micron thick plasma Nitride with round via openings.
The potential multiple is the number of die repeats on the wafer. With the wafer orientated flat down, a right hand coordinate system applies.
Die size is from scribe line to center-to-center. Scribe width is 0.05mm passivated. Each bump is electrically connected to one other bump and isolated from all others to facilitate electrical test.
Bump pitch is defined as center-to-center distance between passivation openings.
Bump height is defined as silicon surface to the top of the bump. Bump diameter is defined as the maximum diameter. UBM = Under Bump Metallurgy Lead-free parts are available with 95.5% Sn/ 3.5% Ag/ 1.0% Cu alloy. Unbumped wafers are available upon special request.
5" Wafer
200 x 200 mils (344 Die) 400x400mil (86 Die)
Sawed 5" Wafer 36 per tray 200 x 200 9 per tray 400x400 Waffle Pack
Call For Availability
Part Number System Pac2.5PB376-100 10mm DC-- --Alloy
PB=Perimeter Bump FA=Full Array
Number of Bumps Pitch
Add “WR” to end of part number for Wafer Cut and left in Seal Ring. Add “TR” to end of part number for die on Tape and Reel. Add “EUT” to end of part number for Eutectic. Add “LF2” to end of part number for Lead-Free. Add “W” to end of part number for Uncut Wafer. Add “unbumped” to end of part number for unbumped wafer/die.
FCT Bump Structure Solder Bump Al, Ni, Cu UBM Al Pad For kit see page 42. 40 Practical Components, Inc.
www.practicalcomponents.com
klaphen@practicalcomponents.com
Die Passivation Die
(SAC305, SAC405) Daisy Chain Die Dimensions–L xW (mm)
UBM is the Al/NiV/Cu (under bump metallization) covering about 1% of the wafer which is under the bumps only. Nitride passivation is an invisible glass-like protective coating over 99% of the wafer, except under the bumps. The bumps will not stick to the Nitride, only the UBM. Nitride coating is standard for all Flip Chip wafers.
Flip Chips
PB08-200x200 PB08-400x400
200 x 200 mils 400 x 400 mils
203 µm, 8 mil 73 µm 95 µm 98 µm
120 µm 88
115 x 115 µm 98/1/1 Al/Cu/Si
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112 |
Page 113 |
Page 114 |
Page 115 |
Page 116 |
Page 117 |
Page 118 |
Page 119 |
Page 120 |
Page 121 |
Page 122 |
Page 123 |
Page 124