PBGA Plastic Ball Grid Array
Amkor Plastic Ball Grid Arrays (PBGA) incorporate advanced assembly pro- cesses and designs for low cost, high performance applications. PBGAs are designed for low inductance, improved thermal operation and enhanced SMT ability.
Some PBGAs are available daisy-chained. All PBGAs are available lead-free.
Part Description
A-PBGA208-1.27mm-23mm* A-PBGA217-1.27mm-23mm* A-PBGA256-1.27mm-27mm* A-PBGA272-1.27mm-27mm* A-PBGA329-1.27mm-31mm A-PBGA356-1.27mm-27mm* A-PBGA388-1.27mm-35mm* A-PBGA420-1.27mm-35mm A-PBGA456-1.27mm-35mm A-PBGA564-1.27mm-40mm*
Notes
* = DC available Parts are packaged in JEDEC trays. Call for tape and reel quantity and availability. Solder ball material is eutectic 63/37 SnPb.
Daisy-chained connections are connections between I/O (input/output) of the component.
BT (Bismaleimide-Triazine) substrates. JEDEC MS-034 standard outlines. Ball diameter varies (see chart).
BGA packages should be baked at 125ºC for 24 hours prior to assembly to prevent delamination during the assembly process.
Moisture sensitivity is JEDEC level 3.
Lead-free parts are available with (SAC405) 95.5% Sn/ 4.0% Ag/ 0.5% Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305) or Sn3.5Ag (call for SnAg availability)
PBGAs are not available without solder balls.
Practical does not guarantee the chain of custody for moisture sensitivity. This is due to the factory making consolidated shipments and customers quantity being met (breaking full tray quantities).
Package Pitch
(1) (2)
PBGA PBGA
PBGA PBGA
Units = mm Notes
1.00 1.00 1.27 1.50
Solder Ball Diameter (A)
0.50 0.63 0.76 0.76
Solder Ball Land On Package and Board
0.45 0.45 0.63 0.63
Solder Ball Height on Package (B)
0.40 0.55 0.60 0.60
Solder Joint Height After SMT* (C)
0.32 0.48 0.52 0.52
*Assumptions: 5 mils Solder Paste Solder Mask Defined Pad
(1) applies to 13, 15 and 17mm packages. (2) applies to 23, 27, 31, 35mm, 37.5mm and 40.0mm packages.
Practical Components, Inc. Tel: 1-714-252-0010 Fax: 1-714-252-0026 35 Eutectic Solder Ball Note: Drawing not to scale.
Solder Ball Diameter/Height (As Received)
A Diameter = Height After Reflow
Solder Ball Height After Ball Attach
B Via Rigid Laminate
I/O Count 208
217 256 272 329 356 388 420 456 564
PBGA Plastic Ball Grid Array 1.27mm Pitch Ball
Pitch
1.27mm 1.27mm 1.27mm 1.27mm 1.27mm 1.27mm 1.27mm 1.27mm 1.27mm 1.27mm
Body Size 23mm
23mm 27mm 27mm 31mm 27mm 35mm 35mm 35mm 40mm
Ball Matrix 17 x 17
17 x 17 20 x 20 20 x 20 23 x 23 20 x 20 26 x 26 26 x 26 26 x 26 30 x 30
Alignment Perimeter Perimeter Perimeter Perimeter Perimeter Perimeter Perimeter Perimeter Perimeter Perimeter
Part Description System Amkor
Plastic Ball Grid Array
I/O Count Pitch Body Size
Quantity Per Tray
60 60 40 40 27 40 24 24 24 21
Available Lead-Free Alloys
SAC405, or SAC305 or Sn3.5Ag SAC405, or SAC305 or Sn3.5Ag SAC405, or SAC305 or Sn3.5Ag SAC405, or SAC305 or Sn3.5Ag SAC405, or SAC305 or Sn3.5Ag SAC405, or SAC305 or Sn3.5Ag SAC405, or SAC305 or Sn3.5Ag SAC405, or SAC305 or Sn3.5Ag SAC405, or SAC305 or Sn3.5Ag SAC405, or SAC305 or Sn3.5Ag
A-PBGA208-1.27mm-23mm-DC-Alloy
Daisy Chain (SAC305,SAC405
and SnAg)
Add “TR” to end of part number for Tape and Reel. Add “SAC405” or “SAC305” or “Sn3.5Ag” to end of part number for Lead-Free.
Mold Compound Die Attach Die Au Wire
Solder Mask
C Motherboard
For kits see pages 98, 100, 102, 109, and 111.
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