SBGA SuperBGA®
SuperBGA® (SBGA) package is a very low profile, high-power BGA. The IC is directly attached to an integrated copper heatsink. Since the IC and the I/O are on the same side, signal vias are eliminated.
Part Description
A-SBGA256-1.27mm-27mm A-SBGA304-1.27mm-31mm A-SBGA352-1.27mm-35mm A-SBGA432-1.27mm-40mm A-SBGA520-1.27mm-40mm A-SBGA560-1.27mm-42.5mm A-SBGA600-1.27mm-45mm
Notes
Superior thermal performance. Light weight Low profile (1.4mm mounted) Moisture resistant (JEDEC level 3) JEDEC MO-192 standard outlines Enhanced electrical performance > 1 GHz Parts are packaged in JEDEC trays. Call for tape and reel quantity and availability. Solder ball material is eutectic 63/37 SnPb.
BGA packages should be baked at 125°C for 24 hours prior to assembly to prevent delamination during assembly process.
Parts can be baked and dry-packed. All components are daisy-chained except for 520 I/O.
Lead-free parts are available with (SAC405 )95.5% Sn/ 4.0% Ag/ 0.5% Cu alloy or 96.5%Sn/3.0%Ag/0.5%Cu alloy (SAC305). Sn3.5Ag is also available (call for availablity).
SBGAs are not available without solder balls.
Solder Ball Diameter/Height (As Received)
A Pb Looking for Lead-Free?
This symbol indicates that lead-free parts are available!
Motherboard
Package SBGA
Practical Components is the exclusive distributor of Amkor Technology Mechanical Components.
All units in mm.
Assumptions: 5 mils solder paste. Solder mask defined pad. Typical moth- erboard no solder mask defined pad:
0.50 Pitch – 0.28 0.80 Pitch – 0.30 1.00 Pitch – 0.38
Pitch 1.27
A .76 B .62 C .52 Diameter = Height After Reflow
Solder Ball Height After Ball Attach
B Wires Mounting Surface Encapsulant Note: Drawing not to scale.
I/O Count 256
304 352 432 520 560 600
Pitch
1.27mm 1.27mm 1.27mm 1.27mm 1.27mm 1.27mm 1.27mm
SBGA SuperBGA® 1.27mm Pitch Body Size 27mm
31mm 35mm 40mm 40mm
42.5mm 45mm
23 x 23 26 x 26 31 x 31 31 x 31 33 x 33 35 x 35
Part Description System Amkor
SuperBGA® I/O Count Pitch Body Size
Ball Matrix 20 x 20
Ball
Alignment Perimeter Perimeter Perimeter Perimeter Perimeter Perimeter Perimeter
A-SBGA256-1.27mm-27mm-DC-Alloy
Daisy Chain (SAC305,SAC405
and SnAg)
Add “TR” to end of part number for Tape and Reel. Add “SAC405” or “SAC305” or “Sn3.5Ag” to end of part number for Lead-Free.
Quantity Per Tray
40 27 24 21 21 12 12
Die
Copper Heat Spreader Copper Ring
Solder Balls Resin Dam (Part of Substrate)
Substrate
C
Practical Components, Inc. Tel: 1-714-252-0010 Fax: 1-714-252-0026
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