Flextac™ BGA Rework Stencil Kit
Flextac™ BGA Rework Stencil Kit includes 20 different sizes of BGA rework stencils, a spatula handle and three sizes of spatula blades. There are a total of 40 stencils in kit (2 stencils per type). Replacement blades are available (see tool kit list for order number).
If you’ve been using metal stencils for BGA rework, we have some great news for you. Flextac™ BGA Rework Stencils…a creative new product that is a major improvement over what you may be using now. These flexible solder paste stencils are laser cut from high quality, anti-static polymer film with a residue-free adhesive backing. Because they are self-sticking, no tape or fixturing is needed. The adhesive seals around each BGA pad to prevent solder paste from bleeding under the stencil when the paste is applied. Flextac™ Stencils are easy to use and leave no residue on the board surface.
Current BGA rework stencils are fabricated from metal and require fixtur- ing or taping to position them and hold them in place. Metal stencils warp easily, and if the circuit board has undulations in the board surface, the metal stencil will not sit flat. Since there is no gasket-like seal, solder paste can easily bleed under metal stencils when paste is applied with a squeegee. Also solder paste can spill out over the sides of flat metal sten- cils contaminating the circuit board surface. Metal stencils require tedious stencil cleaning. To use metal stencils effectively, a high level of operator skill is required.
To use, the operator folds the pre-scored side tabs and then peels off the cover film from the bottom side of the stencil. The operator holds the side tabs while placing the Flextac™ Stencil in position. If it is not correctly positioned, it can simply be removed and repositioned. The side tabs also serve as solder dams preventing overspill. No external taping or fixturing is used. Next the operator applies a small dab of solder paste and uses a standard squeegee to spread the paste. Since the residue-free adhesive seals around each BGA pad, the operator can make as many passes as necessary with the squeegee to assure proper aperture filling. The Flextac™ Stencil is then peeled up leaving a perfect deposit of solder on each pad. Although Flextac™ Stencils are disposable, they can be used several times.
Application Applying solder paste for BGA rework.
Features and Benefits
Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed.
Laser cut ensures precise aperture size. Disposable—eliminates tedious stencil cleaning. Flexible—conforms to board surface. Fold-up sides for easy placement and solder paste containment. Low cost. Packaged in a handy ESD safe carrying case
Kit Part Description 201-3120
Note
Custom pattern stencils are available as special order with up to 2,600 holes per stencil. Please call Practical for quotation.
Description Flextac™ BGA Rework Stencil Kit
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Practical Components, Inc.
www.practicalcomponents.com
klaphen@practicalcomponents.com
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