PoP
Package on Package
Amkor is offering daisy chain samples of their award winning bottom Package Stackable Very Thin Fine Pitch BGA (PSvfBGA) and their top PoP optimized for Package on Package (PoP) requirements. PoP has become the solution of choice for an increasing number of mobile consumer applications for 3D integration of logic and memory devices. Amkor’s PSvfBGA is a high density fine pitch BGA package supporting logic or ASIC devices including base band, application and image processors. PoP stacking allows the OEM greater device, supplier and time to market flex- ibility by sourcing the bottom and top devices from their preferred logic and memory suppliers and then stacking the devices in the PWB surface mount assembly flow. A wide range of leading wireless and mobile integrated device manufacturers are relying on Amkor’s technical and industry leadership in PoP.
Stacked Package
Part Description
PoP Package on Package—Mating Top and Bottom Daisy Chain Samples
Ball
I/O Count
12mm Body Size
A-PoP128-.65mm-12mm-DC A-MPoP128-.65mm-12mm-DC
14mm Body Size
A-PoP152-.65mm-14mm-DC
15mm Body Size
A-PoP160-.65mm-15mm-DC A-PSvfBGA604-.5-15mm-DC
Notes
128 (top package) 128 (middle package) 152 (top package) 160 (top package)
Pitch
.65mm .65mm
.65mm .65mm
Body Size
Ball Matrix
12mm 18x18 12mm 18x18
A-PSvfBGA305-.5mm12mm-DC 305 (bottom package) .65mm (top) - .5m (bottom) 12mm 23x23 14mm 21x21 A-PSvfBGA353-.5mm-14mm-DC 353 (bottom package) .65mm (top) - .5m (bottom) 14mm 26x26 15mm 22x22
604 (bottom package) .65mm (top) - .5m (bottom) 15mm 28x28
Part Description System
Fine pitch 0.5mm bottom package footprints Stacked package heights of 1.2mm to 1.6mm available in a variety of configurations (see Stack Up table on following pages)
Wafer thinning / handling < 100 µm Consistent product performance and reliability Package configurations compliant with JEDEC standards Moisture Resistance Testing is JEDEC Level 3 @ 260 °C Temp Cycle –55/+125 °C, 1000 cycles HAST 130 °C, 85% RH, 96 hours Temp/Humidity 85 °C/85%RH/1000 hours High Temp Storage 150 °C, 1000 hours Board level Thermal Cycle –40/+125 °C, 1000 cycles Parts packaged in JEDEC matrix trays
PoPs are only available Pb-free (not Tin-Lead). Available alloys are: SAC305, SAC405, SAC105 and SAC125Ni*
*SAC125Ni (1.2%Sn/0.5%Ag/.05%Cu/98.25%Ni) is only available for bottom packages.
It is recommended that parts be pre-baked at 125 °C for 48 hrs before using parts regarding moisture concern.
PoP’s are not available without solder balls.
See drawings on the following pages (6–19) for additional technical data. Color coded version avail- able on our website:
www.practicalcomponents.com
Practical Components is the exclusive distributor of Amkor Technology Mechanical Components.
Practical Components, Inc. Tel: 1-714-252-0010 Fax: 1-714-252-0026
5
Please Note
Amkor supporting data is available on our website for: Board Level Reliability (BLR), PoP application notes, PoP Stencil & Stacking paper for SMT Conditions.
IMAPS and SMTA White Paper Articles for additional supporting data available on our website:
www.practicalcomponents.com.
Amkor
Package Stackable Very Thin
Fine Pitch BGA (Bottom Side Only) I/O Count Pitch
I/O Count
128
152 305 353
Alignment
Perimeter Perimeter Perimeter
Perimeter Perimeter
Perimeter Perimeter
A-PSvfBGA305-.5mm-12mm-DC-Alloy
Daisy Chain (SAC305,SAC405,
Body Size
Ball Diameter
Ball Diameter
0.45mm
0.45mm 0.3mm 0.3mm
For recommended kits see pages 88 and 92.
SAC105,and SAC125Ni)
Quantity Per Tray
152 152 152
119 119
112 112
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