DUMMY COMPONENTS
FusionQuad®
(V)FQFP FusionQuad®—Amkor Technology ...........................................4
Package on Package
PoP Package on Package —Amkor Technology ...................................5
Ball Grid Array
CVBGA Very Thin ChipArray® BGA—Amkor Technology..................20 CTBGA ChipArray® CABGA ChipArray®
SuperBGA®
Thin Core BGA—Amkor Technology ..................21 BGA—Amkor Technology ......................................22
—Amkor Technology ...............................................................23
PBGA 1.0mm Pitch—Amkor Technology ...............................................24 PBGA 1.27mm Pitch—Amkor Technology ............................................25
Flip Chips
Flip Chip—Pac Tech .......................................................................................26
MLF
tsCSP Thin Substrate Chip Scale Pkg.—Amkor Technology............28 LGA Land Grid Array—Amkor Technology............................................29 MLF® MicroLeadFrame®—Amkor Technology .....................................30 Dual Row MLF®—Amkor Technology .....................................................31
Quad Flat Packs
TQFP Thin Quad Flat—Amkor Technology ...........................................32 LQFP Low Profile Quad Flat Pack—Amkor Technology ....................33 QFP Quad Flat Pack—Amkor Technology .............................................34 CQFP Ceramic Quad Flat Pack....................................................................35 LCC Leadless Ceramic Carrier .....................................................................35 Daisy-Chain Patterns .....................................................................................36
Dual Packages
PLCC Plastic Leaded Chip Carrier ..............................................................37 SOIC/SOJ Small Outline Integrated Circuit............................................38 TSOP Type I & Type II Thin Small Outline Package— Amkor Technology .................................................................................39 SSOP Small Shrink Outline Package—Amkor Technology ..............40 TSSOP Thin Shrink Small Outline—Amkor Technology ...................41
Passives, Resistors, Discretes
SMR Lead-Free Surface Mount Resistors ................................................42 SMC Lead-Free Surface Mount Ceramic Capacitors .........................43 MELF Resistors Metal Electrode Leadless Face ....................................44 SME Surface Mount Electrolytic Capacitors ..........................................45 MELF Diodes Metal Electrode Face Component Diodes ..................45 SMT Lead-Free Surface Mount Transistors ............................................46 SMTA Surface Mount Molded Tantalum Capacitors ..........................48
Through-Hole
PDIP Plastic Dual In-line Pkg. ......................................................................49 Through-Hole Glass Diodes ........................................................................49 TO Through-Hole Transistors ......................................................................50 Axial Leaded Resistors ..................................................................................50
Industry Acronyms
Industry Acronyms .........................................................................................51
Tape and Reel
CTReels Empty Carrier Tape Reels ............................................................54 Tape and Reel Specifications ......................................................................55
PC BOARDS & KITS
Printed Circuit Boards and Kits
Custom PC Practice Boards and Kits ........................................................56 CircuitCAM™ Software—Aegis Industrial Software ...........................57 Kit Identifier (component part/kit numbers) .......................................58 Single Pack Hand Solder Kits ......................................................................61 SIR Test Board and Kit....................................................................................62 SMTA Saber Evaluation Board and Kit .....................................................63 PC2006 AIM Print Test Board and Kit—AIM ..........................................64 PC000 Lead-Free Zero-Ohm SMD Resistor Board and Kit ................65 PC003 Solder Practice Board and Kit .......................................................66 PC005 BGA Variable Pitch and Array Board and Kits .........................67 PC007 MLF® Test Board and Kits ...............................................................68 PC008 Solder Practice Board and Kits .....................................................70 PC009 Mixed Technology Board and Kit ................................................72 PC011 BGA Fine Pitch Board and Kit .......................................................73 PC012 BGA Global Daisy-Chain Test Kit ..................................................74 PC013 Through-Hole Solder Training Kits .............................................76 PC014 IPC 9850 Attribute Defect Rate Kit .............................................77 PC015 Rework Kits .........................................................................................78 PC016 IPC Compliant Hand Soldering Kit .............................................79 WTK-1 Terminal and Wire Kit ......................................................................80 PC020 Practical SMT Kit ................................................................................81 PC031 Lead-Free Process Capability Validation Kit—Cookson ......82 PC009-40 Traceability & Control Validation Kit—Aegis ....................84 PC049 SMT/PTH Mixed Tech. Pb-Free Kit—Indium Corp. ................86 Future Pac Tech Flip Chip Test Die Kits ....................................................87 PC052 B-52 CRET Cleanliness & Residue Eval. Test Kits ....................88 PC200 PoP 12mm Lead Free-Test Kit—Amkor Technology ............90 PC200 PoP 14mm Lead-Free Test Kit .......................................................94 PC200 PoP 15mm Thermal Cycle Board & Kit—Amkor Tech. .........98 PC200 PoP 15mm Drop Test Board & Kit—Amkor Technology .....99 PC300 176(128/48) FusionQuad® Thermal Cycle Board & Kit— Amkor Technology ..............................................................................103
PC300 216ld FusionQuad® Drop Test Board & Kit— Amkor Technology ..............................................................................104
TOOLS & SUPPLIES
Practical Production Tools
Epoxy Kit—CircuitMedic ...........................................................................106 Professional Repair Kit—CircuitMedic .................................................106 Micro Drill System—CircuitMedic .........................................................107 Plated Hole Repair Kit—CircuitMedic ..................................................107 Beau Tech Soldering Aids .........................................................................108 Flextac™ BGA Rework Stencil Kit ............................................................110 Practical BGA Reballing Kit.......................................................................112
ABSTRACTS
Abstracts—Amkor Technology
A Study on Package Stacking Process for Package-on-Package (PoP) .................................................................................................................114 Board Design, Surface Mount Assembly and Board Level Reliability Aspects of FusionQuad® Packages ....................................120
International Distributors ....................................................................129
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Contents
Dummy Components
PC Boards & Kits
Tools & Supplies
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