M a g a z i n e o n 3 D - I C , T S V , W L P & E m b e d d e d T e c h n o l o g i e s
I S S U E N ° 1 4 F E B R U A R Y 2 0 1 0
E D I T O R I A L
A N A L Y S I S
2010:
Fan-in WLCSP matures, what’s next?
Year of the
Fan-in wafer-level chip-scale packaging is maturing and costs are becoming
CMOS BSI
competitive with other ‘mainstream’ packages, so it begs the question: what’s
sensor
next for wafer-level packaging?
wave?
F
an-in wafer-level chip-scale packaging This isn’t a simple question, because selection of
(WLCSP) is maturing and growing at a fan-in WLCSP still depends largely on package type,
relatively brisk pace, and its success appears die size, and I/O, according to Eric Beyne, program
If you are following recent announcements
to be serving as a springboard of sorts for the director of the Advanced Packaging and Interconnect
in the digital imaging area closely, you may
technology into applications beyond handsets and Research Center at IMEC (Leuven, Belgium; www.
have noticed that CMOS image sensors
also accelerating development of other types of imec.be). Reasons to use wafer-level chip-scale
are on the verge of making another giant
wafer-level packages (WLP). So now is a perfect packages (WLCSPs) primarily involve footprint and
step over CCD technology this year. And
time to take a look at what the industry sees on the package height reductions for portable devices, he
Japanese imaging companies seem to be
horizon for WLP. explains.
leading the way in this area!

Cost
Indeed, Sony made the first step last
Tom Strothmann, manager of WLCSP Business
year by introducing its CMOS BSI sensor
One of the key questions now that fan-in WLCSP is
Development at STATS ChipPAC Inc. (Singapore;
technology. The Japanese electronics
considered mainstream, is: Can it become cheaper
www.statschippac.com), also believes that the use of
than other competing semiconductor packages?
WLCSP is still primarily driven by form factor
To be continued on page 2.
rather than cost. ...
2
C O M P A N Y V I S I O N
IMT on the role of Wafer-Level Packaging in MEMS
Innovative Micro Technology is a MEMS contract manufacturer/foundry partner.
The company operates in one of the largest independent MEMS fabs in the world.
Built for MEMS manufacturing, IMT provides complete foundry services from
design through production.
Printed on recycled paper
Y
ole Développement: What MEMS devices do underway. Of these programs, I would estimate that
you expect to use wafer-level packaging? nearly 75% use WLP for one reason or another. Today,
Craig Trautman: There are several areas I can count four different programs that combine four
in which we expect to see the use of wafer-level wafers that make up some of our more sophisticated
Released SiO2 interlayer dielectric shows a matrix
packaging expand, but interestingly, IMT has been devices. WLP is already being used across all
of copper interconnect traces for interposers and 3D
using WLP for a number of years now. At any given of the markets and in the majority of
time, IMT can have as many as 30 to 40 programs devices we manufacture. ...
6
packaging applications.
T O P 3 F R O M I - M I C R O N E W S . C O M
C O N T E N T S
IPDiA opens multi-parties 3D TSV Silicon Interposer
A N A L Y S I S 2
Program
IPDiA, a leading supplier of silicon passive components and 3D silicon packaging
C O M P A N Y V I S I O N 6
is offering first call to participate to a Through Silicon Via (TSV) Multi Part Wafer
(MPW) program also called “pizza mask”. A N A L Y S T C O R N E R 1 6
T
hrough Silicon Via technology is known to high density packing and financial benefit with a high
offer numerous advantages: application and degree of miniaturization and therefore lower costs. T O P 3 1 8
electrical performance benefits with shortest Thanks to this MPW opportunity, companies which
connections between dies for sensitive signals, double would like to make an evaluation design with Through
side assembly solution resulting in package design Vias in Silicon could take advantage of
simplification and better power supply redistribution, this open proposal and have the product...
18
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