but the actual temperature is higher,
there could be failed devices. Moreover,
most semiconductor parametric and
functional characteristics are temperature
sensitive. Not knowing the actual junction Y.Cheetah
temperature during the final test process
can be costly either by yield reduction or by
reliability failures.
There may be another use for this
technology in the realm of process
development for SMT assembly. Surface
mount process engineers are familiar with
Experience innovative
the current slate of options and tools
which is comprised of some tried and true
method; however the advent of lead-free technology in Y.Cheetah
soldering has taken the industry to the
limits, and IC packages and PCBs are more
vulnerable than at any time in the past
due to the high temperatures required.
Zoom
+
deploying twin magnification axis
Thus it appears that these versatile devices ■
Highest grayscale resolution and image
should capable of serving as an alternative quality for the entire inspection
to current temperature profiling tools,
■ No time-consuming adjustments
providing more detailed information to the
of tube settings
user as to what is actually happening in the
package during reflow.
■ No detector adjustments or calibration
In summary, given the significant
challenges facing the electronics assembly
industry in this new lead-free world, it is
encouraging to know that that there are
tools being developed which might prove
PowerDrive for twin magnification axis
■ Unmatched effective power increase
useful in diagnosing the seemingly endless
for brilliant images
litany of problems we collectively face.
Being able to accurately measure and track
■ Faster image acquisition with ultimate
temperature excursions inside the chip
speed for Y.QuickScan® in µCT applications
package will likely prove a valuable tool ■
Flexibility to address most challenging
in shedding light on the effects of high inspections
temperature soldering on both the IC
■ Inspection at reduced distance and
package and the IC itself giving us a before
lower tube power
unseen picture of what is happening and
what we might expect.
■ Easy operation saves inspection time
Verdant Electronics founder and president
Joseph (Joe) Fjelstad has more than 35 years
of international experience in electronic
Y.Cheetah X-ray inspection System
interconnection and packaging technology in ■
Secure your findings with brilliant
a variety of capacities from chemist to process X-ray images
engineer and from international consultant
■ Any task in your daily routine solved
to CEO. Mr. Fjelstad is also a well known
quickly
author writing on the subject of electronic
interconnection technologies. Prior to founding
Verdant, Mr. Fjelstad co-founded SiliconPipe in
Munich
a leader in the development of high speed productronica
interconnection technologies. He was also
Visit
us
at
11
th
–
13
th
2009
formerly with Tessera Technologies, a global November
leader in chip-scale packaging, where he was
Hall:
A2,
Booth:
330
appointed to the first corporate fellowship for his
innovations.
For further information please contact our sales
organization or visit us at
www.yxlon.com
1
http://www.jedec.org/download/search/
YXLON. The reason why
YXLON International GmbH, a company of the COMET Group. Essener Bogen 15, D-22419 Hamburg,
jesd51-4.pdf
T: +49 40 527 29 - 0, F: +49 40 527 29-170, E-mail:
yxlon@hbg.yxlon.com,
www.yxlon.com
www.globalsmt.net Global SMT & Packaging – October 2009 – 5
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