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The Global Assembly Journal for SMT and Volume 9 Number 9 September 2009
Advanced Packaging Professionals The Global Assembly Journal for SMT and Volume 9 Number 10 October 2009
ISSN 1474 - 0893
Advanced Packaging Professionals ISSN 1474 - 0893
Special
PoP (Package on Package) and vaPor
Phase technology
Mike Nelson
Interview Inside
a baseline study of stencil and screen
Print Processes for wafer backside
coating NEW PRODUCTS
Subscription
fatigue & creeP wearout in INDUSTRY NEWS
electronics: a historical
retrosPective INTERNATIONAL DIARY
What you need to knoW before buying
Mike Scimeca
your aoi solution Interview Inside
sPecial Packaging feature:
Which tools are best for sMt reWork—
imbedded component/die Plus: conduction or convection? NEW PRODUCTS
technology (ic/dt®):
ic packaging and
interconnection business process ManageMent for INDUSTRY NEWS
is it ready for mainstream technologies’ 4th iMproved productivity and custoMer
design applications? dimension challenge satisfaction INTERNATIONAL DIARY
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