New Products
via ProbeShield Technology.
www.suss.com
reworkable underfill for
package-on-package (pop)
The Award Winning
Dage XD7600NT
100
HP
The Ultimate in X-ray Inspection
Zymet’s new reworkable encapsulant, CN-
1728, is designed to underfill package-on-
package (POP) assemblies. Compared to
earlier generation underfills, CN-1728 has
a lower coefficient of thermal expansion
and higher Tg, and better compatibility
with flux residues, both of which
contribute to its superior thermal cycle
performance. CN-1728 is a fast-flowing
capillary underfill with a viscosity of 900
cps, and it can be cured in as little as 1
minute at 150˚C. These properties makes
the underfill suited for high volume, high
speed in-line processing.
www.zymet.com
Depaneler separates metallized
boards without stress to
components
n Unique Dage NT100 sealed-transmissive X-ray
tube providing feature recognition down to
100nm (0.1 microns)
n Unique 10 watts power at sub-micron
feature recognition
n 2.0 Mpixel images with >65,000 greyscale levels
all displayed on a 24” HD monitor
n CT Option
See what the XD7600NT
100
HP can do you for at:
Productronica 2009: Stand A2:361
LEDs are being used in greater frequency
email:
dpi-sales@dage-group.com
on circuit boards today as part of the push
www.dage-group.com
for energy conservation. As boards become
more populated with LEDs, considerable
heat is generated, which means board
manufacturers are using metal inner
layers to help dissipate the heat. Now
the problem becomes one of separating separation, the VPD produces on average low level.
www.fancort.com
the boards in the panel. Conventional
DG-2811 XD7600NT Colour Ad.v2.indd 1
less than 100 microstrains, an extremely
20/8/09 11:56:55
depaneling machines don’t have the right
knife design or enough power to do this
without strain, or rapid wear on the knives. alpha® eF-6103 wave solder flux provides superior performance
Fancort introduced a new depaneling introduced new ALPHA® EF-6103, an alcohol-based flux designed to optimize sol-
machine, the VPD5, designed to separate derability and reliability. It was developed for both standard and thicker, high-density
metalized circuit boards from pre-scored printed circuit board applications in both lead-free (standard SAC and low-Ag SAC
panels without stress and excessive wear alloys) and eutectic SnPb processes. ALPHA® EF-6103 is designed to minimize bridg-
to the knives. The new machine shears ing on bottom side QFPs, as well as providing superior performance in pin testing,
panels with a gentle rocking motion as hole-fill and solderballing. Additionally, it provides good Pb-free solder joint cosmet-
its knives penetrate the score line. Tested ics with an evenly spread, tack free residue.
www.alpha.cooksonelectronics.com
by an independent lab for stress during
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