New Products
New products
medical, aerospace and defense, in applications. Heat-Spring has been tested
which soldering joint reliability has top for the latest PrimePACK configurations
priority. “Vacuum plus,” which is inserted and has been optimized to reduce thermal
immediately after the peak zone in a reflow resistance below that of other more
oven, can be integrated into any reflow traditional thermal interface materials.
soldering system from SMT. www.SMT- www.indium.com
Wertheim.de
“ultimate” Black Top Test detects
counterfeit parts
Soldertec Global believes that it can detect
all blacktopped counterfeit ICs through
its new service called the “Ultimate”
Black Top Test. This new service uses the
industry standard IDEA-STD-1010-A and
oK international Modular then adds greater depth to the testing
rework system set to boost
by looking at higher magnification and
productivity
adding supplementary tests using advanced
OK International has launched its
techniques. The “Ultimate” test regimen
new MRS-1000 Modular Rework
involves 25 different tests and is completed
System. A convection rework system
in approximately a day. This depth of
for the removal and placement of
testing enables the laboratory to pick up
BGA/CSP and SMT components,
all signs of prior use and remarking, with
ecD announces easy oven
the Modular Rework System is
many of the techniques supporting each
verification without use of
comprised of a handheld convection
other and reaffirming earlier suspicions.
thermocouples
tool with a wide array of nozzles,
www.soldertec.com
ECD’s OvenCHECKER™ is the
preheater, adjustable tool holder with
latest addition to its line of award-
board holder, and light magnifier.
winning thermal profiling and oven
With standard features including
verification products. Used to verify
programmability, a digital display,
that ovens remain in spec after a
program storage of up to 50 profiles
board’s initial “characterization” profile,
and adjustability, the system is
OvenCHECKER™ is self-contained
extremely versatile for enhanced
and requires neither thermocouples nor
productivity. www.okinternational.com
repeated use of “golden boards.” This
means the vital step of oven verification
takes place without the time-consuming
Vacuum produces high-quality
task of T/C attachment, reducing
soldering joints production time and, as a result, lowering
“Vacuum plus,” developed by SMT, the costs. And an operator can be trained to
Wertheim-based specialist for thermal use OvenCHECKER” in less than two
processes, is a new system for optimizing minutes. www.ecd.com
solder joints. As the name implies, any
inclusions (bubbles) are eliminated in
suss MicroTec launches 300 mm
a vacuum chamber, which significantly
indium corporation introduces a test solution for 3D integration
improves the quality of the soldered
thermal interface material for igBT SUSS MicroTec launched a new probe
products. This has been eagerly awaited,
modules station, PA300PS 3D, geared for 300 mm
particularly by sensitive industries such as
Indium Corporation’s Heat-Spring® electrical probing of 3D stacked structures
high-performance electronics, automotive,
metallic thermal interface material on wafer level and targeted at the market
(TIM) has been specifically designed for 3D integration. The flexible probe
and optimized for use with Infineon station allows for various engineering and
Technologies AG PrimePACK™ IGBT monitoring tests after wafer production as
modules. Many applications call for a TIM well as before further stacking steps or final
that can easily be placed against a backing packaging.
plate and a cooling solution. Indium’s The system’s functionalities enable a wide
Heat-Spring® is a soft metal alloy (SMA) temperature range and allow collection
developed as a compressible metallic of low signal data in an environment free
shim that can be used in IGBT mounting from electromagnetic interference (EMI)
46 – Global SMT & Packaging – October 2009 www.globalsmt.net
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