to solve. 3. Lee, N.C.
Cleaning process optimization requires (2008, Oct).
a balance of chemical and mechanical Lead-Free Flux
metronelec
effects. The job of the cleaning material Technology
is to remove flux residue and ionic and the
EQUIPMENTS MANUFACTURER SINCE 1979
contaminants. Aqueous cleaning material Influence on
designs contain reactive materials at Cleaning. IPC/
various concentration levels. Aqueous SMTA High
WETTING BALANCE/SOLDERABILIY TESTERS
Low Reactivity cleaning material designs Performance
MENISCO ST78 and MENISCO ST88
provide improved cleaning under low Electronics
standoff components. The driving forces Assembly
that improve performance come from Cleaning
the mixture of solvating materials that Symposium.
rapidly dissolve resin and rosin structures. 4. Russeau, J.
Low reactivity improves the cleaning (2008, Oct).
rate but does not cause compatibility Utilizing and
IN-LINE TOP BOTTOM UV OVEN
concerns. Wetting lowers surface tension Understanding
FOR UV CURABLE CONFORMAL COATING
effects. Minor ingredients control the Various
MET-UV TB310
foaming and protect solder joint finishes. Methodologies
Innovative designs run at lower wash bath for Evaluating
concentrations ranging from 10-13%. Cleanliness of
The cleaning machine design is equally Printed Wiring
important. Fluid management is critical to Assemblies.
containing and keeping the wash chemistry IPC/
IONIC CONTAMINATION TESTERS
within the wash section. Fluid delivery SMTA High
CONTAMINO CT10 - CT100 and CT1000
is critical for penetrating and rapidly Performance
breaking the flux dam under low standoff Electronics
components. To improve cleaning under Assembly
low standoff components, research data Cleaning
indicates that fluid flow, pressure at the Symposium. COME TO SEE OUR EQUIPMENTS HALL A4, BOOTH 315
board surface, directional forces, and time 5. Anthony, S.D.,
in the wash improve the process cleaning Johnson, M.
contact@metronelec.com
rate. The wash section of the cleaning W., Sinfield,
machine is highly important. Research J.V., & Altman,
Center, Rosemont, IL
data findings also indicate that flux not E.J. (2008). The Innovator’s Guide
12. Ellis, D (2007, Feb) Hybrid Drying
adequately removed in the wash will not be to Growth, Harvard Business Press.
Technology for In-line Aqueous
removed in the rinse sections. Boston, MA.
Cleaning of Lead-free Assemblies. Apex
The pace of innovation in the 6. Hugh, S. (2008, Oct). Qualifying
2007
electronics field is staggering. This research Lead-Free Medical Electronics. IPC/
paper highlights collaborative innovation SMTA High Performance Electronics
Dr. Mike Bixenman is the chief technology
in action. In today’s rapidly growing global Assembly Cleaning Symposium.
officer of Kyzen Corporation. mikeb@kyzen.com
economy, customers kaisen (continuously 7. Perng, S. (2008, Oct). Spot Cleaning
improve) their processes. Listening and Assessment under Components
Dirk Ellis is the engineering services manager of
working closely with customer and supply Following Inline Aqueous Cleaning.
Kyzen Corporation. dirk_ellis@kyzen.com
partners who make up the ecosystem is IPC/SMTA High Performance
how innovations that meet customer needs Cleaning Symposium.
John Neiderman is the cleaning applications
take place. Over the past several years, 8. Byle, F, & Eichstadt, (2005, June).
manager of Speedline Technologies.
cleaning chemistries and cleaning machines Enhancing Flip Chip Reliability.
jneiderman@speedlinetech.com
have continuously improved to meet the Advanced Packaging, www.apmag.com
challenges of cleaning highly dense and 9. IPC (1990, Dec). IPC-CH-65A:
miniaturized circuit assemblies. Guidelines for Cleaning of Printed
Boards and Assemblies. IPC,
references Northbrook, IL.
1. Fisher, J. (2008, Oct). IPC Technology 10. Woody, L. (2008, Oct). Nozzle Design
Roadmap Future of Interconnection and Implementation for Cleaning
Technology and Its Impact on Cleaning Residues from High Density, Low
for Reliability. IPC/SMTA High Profile Component Assemblies. IPC/
Performance Electronics Assembly SMTA High Performance Electronics
Cleaning Symposium. Assembly Cleaning Symposium.
2. Ellis, B., Pauls, D. (2008, Jan). What 11. Stach, S., & Bixenman, M. (2004, Sep).
is Involved with Going No-Clean. Optimizing Cleaning Energy in Batch
Retrieved from http://listserv.ipc.org/ and Inline Systems. SMTAI Technical
scripts/wa.exe?A0=TechNet Forum. Donald Stevens Convention
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